Title:
CASE MOLD
Document Type and Number:
WIPO Patent Application WO/2023/013685
Kind Code:
A1
Abstract:
Provided is a case mold capable of reducing the time until the start of manufacturing of a product using a forming mold, and reducing manufacturing costs of the forming mold. Also, molding of a modelling object corresponding to 3D data which has a higher degree of freedom in manufacturing is realized. A case mold 1 is for the manufacturing of a forming mold used for molding and is a split mold composed of at least two molds. The case mold 1 is a layered molded body including a resin composition containing, for example, polylactic acid (PLA) and acrylonitrile-butadiene-styrene copolymer (ABS). The forming mold is a gypsum mold, namely, solidified gypsum.
Inventors:
UCHIYAMA YUKICHI (JP)
UCHIYAMA TAKAFUMI (JP)
UCHIYAMA TAKAFUMI (JP)
Application Number:
PCT/JP2022/029824
Publication Date:
February 09, 2023
Filing Date:
August 03, 2022
Export Citation:
Assignee:
UCHIYAMA SEITOSHO CO LTD (JP)
International Classes:
B29C33/40; B28B7/34; B29C64/118; B33Y80/00
Foreign References:
| JP2003011129A | 2003-01-15 | |||
| JP2001062929A | 2001-03-13 | |||
| JP2017514725A | 2017-06-08 | |||
| JP2014231164A | 2014-12-11 |
Attorney, Agent or Firm:
WAKI Hikaru et al. (JP)
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