Title:
CATALYST INK FOR PLATING AND ELECTROLESS PLATING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2020/067601
Kind Code:
A1
Abstract:
A catalyst ink for plating and a method for electrochemically manufacturing an electronic device by using same are disclosed. The present invention provides a catalyst ink for plating, comprising: a polymer binder; a metal ion as a catalyst; a silane coupling agent for coupling the metal ion and the polymer; and a solvent, wherein the polymer has a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system, and the lower critical solution temperature is 30°C or higher. According to the present invention, a high resolution plated pattern having a line width and a width between lines can be manufactured.
Inventors:
SEOL SEUNG KWON (KR)
LEE SANG HYEON (KR)
CHANG WON SUK (KR)
PYO JAE YEON (KR)
LEE SANG HYEON (KR)
CHANG WON SUK (KR)
PYO JAE YEON (KR)
Application Number:
PCT/KR2018/012831
Publication Date:
April 02, 2020
Filing Date:
October 26, 2018
Export Citation:
Assignee:
KERI KOREA ELECTROTECHNOLOGY RES INST (KR)
International Classes:
C23C18/16; C09D11/03; C09D11/033; C09D11/10; C23C18/20; H05K3/18
Foreign References:
| JP2017210630A | 2017-11-30 | |||
| KR20120120155A | 2012-11-01 | |||
| KR20140027920A | 2014-03-07 | |||
| KR20100134792A | 2010-12-23 | |||
| JP2016194150A | 2016-11-17 |
Attorney, Agent or Firm:
HMP IP GROUP (KR)
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