FIELD

[0001] Embodiments described herein relate to a cathode assembly, a deposition apparatus having one or more cathode assemblies and a method for deinstalling a cathode assembly. Embodiments described herein relate specifically to a cathode assembly having a side element provided with at least one opening for draining coolant from the cathode assembly. Embodiments described herein relate specifically to a method of draining coolant from the cathode assembly during deinstallation.

BACKGROUND

[0002] In many applications, it is necessary to deposit thin layers on a substrate. The substrates can be coated in one or more chambers of a coating apparatus. The substrates may be coated in a vacuum, using a vapor deposition technique.

[0003] Several methods are known for depositing a material on a substrate. For instance, substrates may be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process etc. The process is performed in a process apparatus or process chamber where the substrate to be coated is located. A deposition material is provided in the apparatus. A plurality of materials, and also oxides, nitrides or carbides thereof, may be used for deposition on a substrate. Coated materials may be used in several applications and in several technical fields. For instance, substrates for displays are often coated by a physical vapor deposition (PVD) process. Further applications include insulating panels, organic light emitting diode (OLED) panels, substrates with thin film transistors (TFT), color filters or the like.

[0004] For a PVD process, the deposition material can be present in the solid phase in a target.

By bombarding the target with energetic particles, atoms of the target material, i.e. the material to be deposited, are ejected from the target. The atoms of the target material are deposited on the substrate to be coated. In a PVD process, the sputter material, i.e. the material to be deposited on the substrate, may be arranged in different ways. For instance, the target may be made of the material to be deposited or may have a backing element on which the material to be deposited is fixed. The target including the material to be deposited is supported or fixed in a predefined position in a deposition chamber. In the case where a rotatable target is used, the target is connected to a rotating shaft or a connecting element connecting the shaft and the target.

[0005] Segmented planar, monolithic planar and rotatable targets may be used for sputtering. Due to the geometry and design of the cathodes, rotatable targets typically have a higher utilization and an increased operation time than planar targets. The use of rotatable targets may prolong service life and reduces costs.

[0006] Sputtering can be conducted as magnetron sputtering, wherein a magnet assembly is utilized to confine the plasma for improved sputtering conditions. The plasma confinement can be utilized for adjusting the participle distribution of the material to be deposited on the substrate.

[0007] The target typically becomes heated during deposition. Hence, a coolant is typically provided for cooling the target. However, specifically during target exchange, there is a likelihood that the coolant drains into the deposition apparatus. This can lead to a contamination of the deposition apparatus and can decrease production quality and can shorten maintenance intervals.

[0008] Thus, there is a need to safely remove coolant from the target to make sure that the deposition apparatus is not contaminated. In some cases, draining coolant can compromise the quality of the deposited layers, or in some cases even lead to damage or breakdown of the apparatus. Therefore, there is an ongoing need to improve coolant removal from the deposition apparatuses.

SUMMARY

[0009] According to an embodiment, a cathode assembly is provided. The cathode assembly includes a rotatable tube having a rotational axis, a first end and a second end, the first end being opposite the second end along a direction of the rotational axis. The cathode assembly includes a coolant receiving enclosure in the rotatable tube. The cathode assembly includes a side element provided at the first end of the rotatable tube. The side element has at least one opening configured to enable coolant to be drained from the coolant receiving enclosure out of the rotatable tube.

[0010] According to a further embodiment, a deposition apparatus for depositing a material on a substrate is provided. The deposition apparatus includes a cathode assembly. The cathode assembly includes a rotatable tube having a rotational axis, a first end and a second end, the first end being opposite the second end along a direction of the rotational axis. The cathode assembly includes a coolant receiving enclosure in the rotatable tube. The cathode assembly includes a side element provided at the first end of the rotatable tube. The side element has at least one opening configured to enable coolant to be drained from the coolant receiving enclosure out of the rotatable tube. The deposition apparatus includes a support device connectable to the cathode assembly. The support device has a channel to drain the coolant out of the cathode assembly.

[0011] According to a further embodiment, a method for deinstalling a cathode assembly from a support device is provided. The method includes introducing a gas into the cathode assembly in order to drain coolant out of the cathode assembly. The method includes rotating the cathode assembly. The method includes disconnecting the cathode assembly from the support device.

[0012]

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] A full and enabling disclosure to one of ordinary skill in the art is set forth more particularly in the remainder of the specification including reference to the accompanying drawings wherein:

FIG. 1 shows a cathode assembly and a support device according to embodiments described herein;

FIG. 2 shows a cathode assembly and a support device according to embodiments described herein;

FIG.3 shows an example of gas being introduced into a cathode assembly in order to drain coolant out of the cathode assembly according to embodiments described herein;

FIG. 4 shows an example of gas being introduced into a cathode assembly in order to drain coolant out of the cathode assembly according to embodiments described herein;

FIG. 5 shows a deposition apparatus as described herein; and FIG. 6 shows a method for deinstalling a cathode assembly from a support device according to embodiments described herein.

DETAILED DESCRIPTION

[0014] Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation and is not meant as a limitation. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0015] The drawings are schematic drawings which are not drawn to scale. Some elements in the drawings may have dimensions which are exaggerated for the purpose of highlighting aspects of the present disclosure and/or for the sake of clarity of presentation.

[0016] Embodiments described herein relate to a deposition apparatus for depositing a material on a substrate. In a deposition process or coating process, a layer of target material is deposited on a substrate. The substrate is coated with the material. The terms “coating process” and “deposition process” are used synonymously herein.

[0017] A deposition apparatus according to embodiments described herein may be configured for deposition on horizontally oriented substrates. The term “horizontally oriented” may include substrates which are arranged at a small deviation from exact horizontally, e.g. an angle of up to 10° or even 15° may exist between the substrate and the exact horizontal direction.

[0018] A deposition apparatus according to embodiments described herein may be configured for deposition on large area substrates.

[0019] A substrate as described herein may be a large area substrate. The term “substrate” as used herein includes substrates which are typically used for display manufacturing. For example, substrates as described herein can be substrates which are typically used for an LCD (Liquid Crystal Display), an OLED panel, and the like. For instance, a large area substrate can be GEN 4.5, which corresponds to about 0.67 m ² substrates (0.73 x 0.92m), GEN 5, which corresponds to about 1.4 m ² substrates (1.1 m x 1.3 m), GEN 6, which corresponds to about 2.8 m ² substrates (1.85 m x 1.5 m), GEN 7.5, which corresponds to about 4.29 m ² substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7m ² substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m ² substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.

[0020] The term “substrate” as used herein shall particularly include substantially inflexible substrates, e.g., a wafer, slices of transparent crystal such as sapphire or the like, or a glass plate. In particular, the substrates can be glass substrates and/or transparent substrates. The present disclosure is not limited thereto and the term “substrate” may also embrace flexible substrates such as a web or a foil. The term “substantially inflexible” is understood to distinguish over “flexible”. Specifically, a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates.

[0021] A deposition apparatus according to embodiments described herein can include one or more cathode assemblies, particularly a plurality of cathode assemblies. A cathode assembly should be understood as an assembly which is adapted for being used as a cathode in a coating process, such as a sputter deposition process.

[0022] A cathode assembly according to embodiments described herein may be a rotatable cathode assembly. A cathode assembly may include a target, particularly a rotatable target. A rotatable target may be rotatable around a rotation axis of the rotatable target. A rotatable target may have a curved surface, for example a cylindrical surface. The rotatable target may be rotated around the rotation axis being the axis of a cylinder or a tube. A cathode assembly may include a backing tube. A target material forming the target, which may contain the material to be deposited onto a substrate during a coating process, may be mounted on the backing tube. Alternatively, the target material may be shaped as a tube without being provided on a backing tube.

[0023] A cathode assembly may include a magnet assembly. A magnet assembly may be arranged in a cathode assembly of the cathode assembly. A magnet assembly may be surrounded by target material. A magnet assembly may be arranged so that the target material sputtered by the cathode assembly is sputtered towards a substrate. A magnet assembly may generate a magnetic field. The magnetic field may cause one or more plasma regions to be formed near the magnetic field during a sputter deposition process. The position of the magnet assembly within a cathode assembly affects the direction in which target material is sputtered away from the cathode assembly during a sputter deposition process.

[0024] In operation, an un-cooled cathode assembly, particularly an uncooled magnet assembly of the cathode assembly, may become hot due to the fact that the magnet assembly is surrounded by target material that is bombarded with ions. The resulting collisions lead to a heating up of the cathode assembly. In order to keep the magnet assembly at a suitable operating temperature, a cooling of the cathode assembly, particularly of the target material and the magnet assembly may be provided.

[0025] A deposition apparatus according to embodiments described herein may be configured for vacuum deposition. The deposition apparatus may include a processing chamber, particularly a vacuum chamber. A cathode assembly as described herein, or at least a part of the cathode assembly, may be arranged in the processing chamber.

[0026] Fig. 1 shows a cross-section of a deposition apparatus 100 according to embodiments described herein. The cross-section is in a direction parallel to a rotation axis of the cathode assembly 10.

[0027] According to an embodiment, and as shown for example in Fig. 1, a deposition apparatus 100 for depositing a material on a substrate and/or a cathode assembly is provided. The deposition apparatus 100 can include the cathode assembly 10. The deposition apparatus 100 includes a coolant space or coolant receiving enclosure 20. The coolant receiving enclosure 20 can receive a coolant 22 to cool the cathode assembly 10.

[0028] A deposition apparatus 100 according to embodiments described herein may be a sputter deposition apparatus. A cathode assembly 10 as described herein may be a sputter cathode assembly. The cathode assembly 10 may include a target as described herein. The target may be rotatable around a rotation axis of the target. The target may have a curved, e.g. substantially cylindrical, surface. The cathode assembly 10 may include a magnet assembly as described herein. The magnet assembly may be arranged in the cathode assembly 10.

[0029] A cathode assembly 10 as described herein may include a target. During operation of the cathode assembly 10, e.g. during a coating process in which material from the target is deposited on a substrate, the cathode assembly 10, particularly the target, may experience a heating. The coolant receiving enclosure 20 having the coolant 22 may be configured to cool the target of the cathode assembly 10. The coolant receiving enclosure 20 having the coolant 22 may be configured to cool the cathode assembly 10, particularly the target, during a deposition process, such as a sputtering process.

[0030] A coolant 22 as described herein may be configured for cooling the cathode assembly 10. The coolant 22 may be configured for cooling a magnet assembly of the cathode assembly 10. The magnet assembly may be arranged in an interior region of the cathode assembly, e.g. in a hollow region surrounded by target material. The coolant 22 may be a liquid coolant, such as e.g. water, more particularly cooling water. Other liquid coolants suitable for cooling a cathode assembly 10 may also be used.

[0031] As shown for example in Fig. 1, at least a portion of the coolant receiving enclosure 20 may be inside the cathode assembly 10. At least a portion, particularly a main portion, of the coolant receiving enclosure 20 may be surrounded by a curved surface, particularly a tube shaped surface, of the cathode assembly 10. The curved surface may be a curved surface of a target of the cathode assembly 10.

[0032] As shown for example in Fig. 1, a portion of the coolant receiving enclosure 20 may be inside a support device 230 as described herein. The support device 230 may support the cathode assembly 10. The portion of the coolant receiving enclosure 20 inside the support device 230 may be smaller in volume than the remaining portion of the coolant receiving enclosure 20 outside of the support device 230.

[0033] Fig. 2 shows a cross-section of a deposition apparatus 100 according to embodiments described herein. The deposition apparatus 100 shown in Fig. 2 includes the cathode assembly 10 and the support device 230. Further, Fig. 2 depicts the coolant receiving enclosure 20 being filled with coolant 22, e.g., up to a coolant level 21.

[0034] A cathode assembly 10 as described herein may be a rotatable cathode assembly. The cathode assembly 10 may have a rotation axis 250 extending in a first direction 252, as shown for example in Fig. 2. The cathode assembly 10 may be rotatable around the rotation axis 250. The rotation axis 250 may be a horizontal rotation axis. The coolant receiving enclosure 20 may be a longitudinal enclosure having a length in the first direction 252. At least a portion of the coolant receiving enclosure 20 may extend in the first direction 252 over a length being 60% or more of a length of the cathode assembly 10 in the first direction 252. The coolant receiving enclosure 20 may be configured to cool a target of the cathode assembly 10 substantially over an entire length of the target in the first direction 252. [0035] A coolant receiving enclosure 20 as described herein may be tube-shaped in a direction parallel to a rotation axis of the cathode assembly 10.

[0036] As shown for example in Fig. 2, a deposition apparatus 100 as described herein may include a support device 230 supporting the cathode assembly 10. For example, the cathode assembly 10 may have, or be mounted to, a flange. The flange may be mounted on the support device 230.

[0037] A support device 230 as described herein may be adapted to be mounted to a non revolving part, typically to a wall, flap or door, of the deposition apparatus 100.

[0038] A support device 230 as described herein may be a cathode drive unit. A cathode drive unit may be configured for supplying power to the cathode assembly 10. A cathode drive unit may include or be connectable to a power supply for supplying power to the cathode assembly 10. Additionally or alternatively, a cathode drive unit may be configured for supplying water or coolant to the cathode assembly 10 and/or to the coolant receiving enclosure 20. A cathode drive unit may include or be connectable to a water or coolant supply for supplying water or coolant to the cathode assembly 10. Additionally or alternatively, a cathode drive unit may be configured for driving a rotation of the cathode assembly 10. A cathode drive unit may include an actuator for driving a rotation of the cathode assembly 10. A cathode drive unit may be configured for performing any combination of the above-described functions.

[0039] A cathode drive unit as described herein may be referred to as an end block or cathode drive block.

[0040] A support device 230 as described herein may be arranged next to the cathode assembly 10. The support device 230 may have a body portion 232 or main body. The body portion 232 may have a hollow space therein. The support device 230, particularly the body portion 232, may be configured to remain stationary during a rotation of a target of the cathode assembly 10. The target may be configured to rotate relative to the support device 230, particularly relative to the body portion 232. The support device 230 does not rotate together with the target.

[0041] According to embodiments described herein, the cathode assembly 10 can include a rotatable tube 622. The rotatable tube 622 can have a rotational axis, which can coincide with the rotation axis 250 cathode assembly 10. The rotatable tube 622 can be configured to rotate around the rotational axis, e.g. the rotation axis 250 cathode assembly 10. The rotatable tube

622 can further have a first end and/or a second end. The first end can be opposite the second end along a direction of the rotational axis. The rotatable tube 622 can surround at least a portion of the coolant receiving enclosure 20.

[0042] According to embodiments described herein, the cathode assembly 10 can include a side element 624. The side element 624 can be provided at the first end of the rotatable tube 622. The side element 624 can have at least one opening 625. The at least one opening can be configured to enable coolant 22 to be drained from the coolant receiving enclosure 20 out of the rotatable tube 622. For example, the coolant can be drained from the coolant receiving enclosure 20 into the support device 230, particularly to the body portion 232, according to embodiments described herein, wherein the side element 624 is a flange.

[0043] Embodiments described herein provide the benefit that, e.g. by way of the draining opening, a leakage of the coolant 22 out of the coolant receiving enclosure 20, specifically during deinstallation of the cathode assembly, can be reduced or even avoided. In light thereof, a potential malfunctioning of the deposition apparatus or damage to the deposition apparatus 100 resulting from the leaked coolant can be contained or even prevented. For example, short circuits or corrosion of parts of the deposition apparatus 100 can be avoided. In light thereof, embodiments described herein allow increasing the lifetime of the deposition apparatus.

[0044] According to embodiments described herein, the at least one opening 625 is provided in a first half of the side element 624. The first half can be defined by a line orthogonal to the rotational axis. For example, in the case of a horizontally arranged cathode assembly, i.e. with the rotational axis being horizontally aligned, the first half can be defined by a horizontal line running through the rotational axis and being orthogonal to the rotational axis. Specifically, the first half can be the portion of the side element 624 below this horizontal line.

[0045] More specifically, the side element 624 can be formed such as to not include an opening configured to enable coolant to be drained from the coolant receiving enclosure 20 out of the rotatable tube 622 in the complementary second half of the side element. That is, the side element 624 can include openings configured to enable coolant to be drained from the coolant receiving enclosure 20 out of the rotatable tube 622 in one half only.

[0046] Fig. 3 illustrates gas 254 being introduced into a cathode assembly 10 in order to drain coolant out of the cathode assembly 10. [0047] The example of Fig. 3 shows that gas 254 is introduced into a cathode assembly 10. In particular, the gas can be provided with pressure into the cathode assembly 10, such that it supports to actively drain coolant out of the cathode assembly 10, specifically the coolant receiving enclosure 20. For example, the gas can be applied with a pressure of 2 to 6 bar over pressure, specifically 3 to 5 bar over pressure. The term “over pressure” can be understood in the context of the present application as a pressure value above the surrounding or environmental pressure. For example, if the cathode assembly 10 is at a pressure of about 1 bar, applying the gas with an overpressure of 5 bar means that the gas is applied with a pressure of 5 bar more than the surrounding or environmental pressure of 1 bar, i.e. the gas is applied with a pressure of 6 bar. The introduction of gas can support reducing the coolant level 21, e.g., to a height of the opening 625.

[0048] The side element 624 can have a width along the rotation axis 250. For example, the width can be from about 10 to about 30mm, specifically about 15 to about 25 mm. Further, the width can depend on the intended water flow. The at least one opening 625 can have a length long enough to extend along the width of the side element 624. The at least one opening 625 can thus be formed through the side element 624.

[0049] As shown in the example of Fig. 3, the at least one opening can be sloped or inclined. Specifically, the at least one opening 625 can be formed with an angle with respect to the rotation axis 250. For example, the at least one opening 625 can be formed with an acute angle with respect to the rotation axis 250. The acute angle can be open towards the cathode assembly 10. The acute angle can provide an arrangement in which a portion of the at least one opening 625 at the side of the cathode assembly is further away from the rotational axis 250 and a portion of the at least one opening 625 at the side of the support device 230 is closer to the rotational axis 250.

[0050] According to embodiments described herein, the support device 230 includes at least one outlet opening 234 corresponding to the at least one opening 625 of the cathode assembly. In the case of sloped or inclined openings, the at least one outlet opening 234 can be closer to the rotational axis 250 than the portion of the at least one opening 625 at the side of the cathode assembly 10. The at least one outlet opening 234 and/or the at least one opening 625 can be connected to a channel 233 of the support device 230. The channel 233 may be in fluid connection with the coolant receiving enclosure 20. The channel 233 can be configured to receive the coolant from the cathode assembly 10 and/or drain the coolant out of the support device 230. The channel 233 may be configured to discharge the received coolant, particularly heated coolant. In particular, the channel 233 may transport coolant away from the cathode assembly 10, e.g. to a position where the coolant can safely be disposed. By way of the channel 233 configured to receive the coolant, the leaked coolant does not come into contact with other parts of the system.

[0051] According to embodiments described herein, the at least one opening 625 can be formed proximate to the curved surface surrounding the coolant receiving enclosure 20, specifically at the side of the cathode assembly 10. That is, the portion of the at least one opening 625 at the side of the cathode assembly 10 can be formed at the radially most outward position. Providing the at least one opening 625 at a radially outward position can provide the benefit of supporting coolant being drained from the coolant receiving enclosure 20 and/or the rotatable tube 622. In other words, the at least one opening 625, specifically the portion of the at least one opening 625 at the side of the cathode assembly 10 can be formed as far away from the rotation axis 250 as possible. When practicing embodiments, the water blow-out level can be lowered, leading to less water remaining in the cathode assembly 10. The angled/sloped orientation can even support this effect.

[0052] As described herein, a gas can be introduced into the cathode assembly 10 in order to drain coolant out of the cathode assembly 10, specifically the coolant receiving enclosure 20. According to embodiments, the cathode assembly 10 can include a gas inlet configured to receive the gas. The gas can be provided with a pressure, pushing the coolant out of, e.g., the coolant receiving enclosure 20 through the at least one opening 625. In the case of a sloped or inclined opening, the pressure can be high enough to push the coolant up through the sloped or inclined at least one opening 625 and, e.g., into the channel 223.

[0053] Fig. 4 shows a cross-section of a deposition apparatus 100 according to embodiments described herein.

[0054] As shown for example in Fig. 4, a support device 230 as described herein may include a gas supply channel 610 for supplying gas, particularly cold gas, as indicated by the arrow 612.

[0055] As shown for example in Fig. 6, coolant receiving enclosure 20 as described herein may include a coolant receiving portion for receiving coolant. The coolant receiving portion may define a volume. The coolant receiving portion may be a radially outward portion of the coolant receiving enclosure 20. The terms “radially outward” and “radially inward” may be defined relative to the rotation axis of the cathode assembly 10. The coolant receiving portion may be surrounded by the rotatable tube 622 of the cathode assembly 10. The gas supply channel 610 may be configured for supplying gas, particularly cold gas, to the coolant receiving enclosure 20, specifically the coolant receiving portion. The gas supplied by the gas supply channel 610 may be guided through the gas receiving portion. The gas may be guided in a horizontal direction through the coolant receiving portion. The gas may be guided to a region adjacent to the target of the cathode assembly 10.

[0056] As shown for example in Fig. 6, the gas supply channel 610 may be radially inward with respect to the coolant receiving portion. The gas supply channel 610 may be a volume in an interior region of a rotary shaft 632 of the cathode assembly 10. The rotary shaft 632 may be configured to be rotated for driving the rotation of the target. The gas may be guided through the gas supply channel 610, as indicated by the arrow 612. The gas may be guided in a horizontal direction through the gas supply channel 610, particularly through the rotary shaft 632.

[0057] According to embodiments described herein, the gas supply channel 610 can be connected to or form the gas inlet of the cathode assembly 10. Further, the cathode assembly 10 can include more than one gas inlet. Having more than one gas inlet can support homogeneity of gas distribution in the coolant receiving enclosure and proving the gas with a high pressure.

[0058] According to embodiments described herein, the cathode assembly 10 includes a gripping element 626. The gripping element 626 can be configured to support deinstallation of the cathode assembly 10. For example, the gripping element can be a hook or similar structure, which a mating structure can grip and, e.g., pull the cathode assembly 10 upward.

[0059] The gripping element 626 can be provided in a portion of the cathode assembly 10 corresponding to the first half. Worded differently, the gripping element 626 can be provided at the side of the cathode assembly where the at least one opening 625 is provided. Specifically, the gripping element 626 can be provided in a portion of the circumference of the rotatable tube 622 corresponding to the portion where the at least one opening 625 is provided. Providing the gripping element at the same side as the at least one opening can provide the benefit that the cathode assembly is to be rotated first before it can be deinstalled. The rotation of the cathode assembly can bring the at least one opening to an upper position, preventing remaining coolant from flowing out of the at least one opening. [0060] Fig. 5 schematically shows a cross section of a deposition apparatus 100 along the rotation axis 250 according to embodiments. The deposition apparatus 100 may include a processing chamber 710 formed by walls 712 and 714. According to typical embodiments, the rotation axis 250, the target, and/or the backing tube are essentially parallel to the wall 712 to which the support device 230, particularly the cathode drive unit, is attached. A drop-in configuration of the cathode assembly can be realized.

[0061] As shown for example in Fig. 7, at least one support device 230 as described herein is mounted to the processing chamber 710 such that the body portion 232 of the support device 230 is not rotatable relative to the walls 712 of the processing chamber 710. The body portion 232 is typically fastened via an insulating plate 722 to a flap or door 730 of the processing chamber 710. During sputtering, the flap or door 730 is closed. Accordingly, the body portion 232 is typically stationary, at least non-rotatable, during sputtering. Alternatively, an external housing 735 may be fastened directly to a wall 712 of the processing chamber 710.

[0062] According to embodiments, a target flange 770 is arranged on and vacuum tightly mounted to the bearing housing 723. Typically, an O-ring seal is arranged between the bearing housing 723 and the target flange 770. As the target flange 770 and the bearing housing 723 are typically non-rotatably coupled to each other, a rotatable target mounted on top of the target flange 770 may be rotated by a rotating drive.

[0063] During sputtering, the external housing does not typically rotate relative to the process chamber in which the sputtering is carried out. During sputtering, at least an upper part of? the target flange 770 is typically arranged outside the external housing, i.e. in a low pressure or vacuum environment. Different thereto, the internal space of the external housing is typically at normal and/or a higher pressure than the process chamber.

[0064] According to embodiments, a rotating drive 750, typically an electrical drive, is arranged outside the processing chamber 710 via a mounting support 752. The rotating drive 750 may also be placed within the external housing 735. Typically, the rotating drive 750 drives the rotatable target 740 of the cathode assembly during sputtering via a motor axis 754, a pinion 753 connected thereto and a chain or a toothed belt (not shown) which loops around the pinion 753 and a gear-wheel 751 attached to a bearing housing 723 of a rotor 725. The rotor 725 may be adapted to mechanically support the rotatable target 740. [0065] Typically, coolant support tubes 734 and/or electrical support lines are fed from a coolant supply and discharge unit 780 and/or an electrical support unit through the external housing 735 to the outside of the processing chamber 710.

[0066] The coolant support tubes 734 may be in fluid communication with the coolant receiving enclosure 20 as described herein. For example, the coolant support tubes 734 may be in fluid communication with the at least one opening 625 described herein. Further, the coolant support tubes 734 may be in fluid communication with the channel 233 described herein.

[0067] The cathode assembly 10 may include the rotatable tube 622 and the side element 624 as described herein. The cathode drive unit may be a support device 230 as described herein.

[0068] According to embodiments described herein, a deposition apparatus 100 for depositing a material on a substrate can be provided. The deposition apparatus can include a cathode assembly 10. The deposition apparatus 100 can include a support device 230 connectable to the cathode assembly 10. The support device can have a channel 223 to drain coolant 22 out of cathode assembly 10. The cathode assembly 10 can include a rotatable tube 622 having a rotational axis, a first end and a second end, the first end being opposite the second end along a direction of the rotational axis. The cathode assembly 10 can include a coolant receiving enclosure 20 in the rotatable tube (622). The cathode assembly 10 can include a side element 624 provided at the first end of the rotatable tube 622. The side element 624 can have at least one opening 625 configured to enable coolant to be drained from the coolant receiving enclosure 20 out of the rotatable tube 622.

[0069] According to embodiments described herein, the support device 230 is a cathode drive unit configured for: supplying power to the cathode assembly; or supplying coolant to the cathode assembly; or driving a rotation of the cathode assembly; or any combination thereof.

[0070] According to embodiments described herein, the deposition apparatus 100 is a sputter deposition apparatus and the cathode assembly is a sputter cathode assembly.

[0071] Fig. 6 shows a method 900 for deinstalling a cathode assembly 10 from a support device 230 according to embodiments described.

[0072] The method 900 includes a block 910 for introducing a gas into the cathode assembly 10 in order to drain coolant out of the cathode assembly 10. For example, the gas can be introduced with pressure into the cathode assembly 10 to force coolant in the cathode assembly 10 out of the cathode assembly 10.

[0073] The method 900 includes a block 920 for rotating the cathode assembly 10. Specifically, the cathode assembly 10 can be rotated after the coolant has been drained from the cathode assembly 10. For example, the cathode assembly 10 can be rotated by about 150 to about 210°, e.g. by about 180°.

[0074] The method 900 includes a block 930 for disconnecting the cathode assembly 10 from the support device 230. Disconnection of the cathode assembly 10 can be supported by, e.g., the gripping element 626 described herein.

[0075] According to embodiments described herein, the cathode assembly 10 can include at least one opening configured to enable coolant to be drained out of the coolant receiving enclosure 20, such as the at least one opening 625 described herein. Rotating the cathode assembly 10 can include rotating the at least one opening 625 from a lower position to an upper position with respect to gravity. By rotating the at least one opening from a lower position to an upper position with respect to gravity, remaining coolant can be prevented from draining from the cathode assembly during and/or after deinstallation.

[0076] While the foregoing is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.