CATHODE PLATE FOR METAL ELECTRODEPOSITION AND MANUFACTURING METHOD FOR SAME

WIPO Patent Application WO/2018/220979

A1

Provided are: a cathode plate for metal electrodeposition which makes it less likely to lose a non-conductive film on a metal plate, which can be used repeatedly, and for which maintenance is easy even if a non-conductive film is lost; and a manufacturing method for such cathode plate. This cathode plate 1 includes a metal plate 2 on which a plurality of disk-shaped projections 2a are arranged, and a non-conductive film 3 formed in flat sections 2b which are sections of the metal plate 2 other than the projections 2a. The projections 2a each have a side face that has a shape formed of a substantially vertical section 2d and an inclined section 2e. A height L1 of each projection 2a is 50µm to 1000µm, and when an intersection of the side face of the projection and a vertical line that is vertically lowered from a position X that is 20µm outward from the outer peripheral edge of the projection is defined as Y, then a length L2 from X to Y is at least 40µm but not more than 0.8×L1µm.

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WATANABE HIROTO (JP)
MATSUOKA ITSUMI (JP)
SENBA YUSUKE (JP)
KOBAYASHI HIROSHI (JP)

PCT/JP2018/013187

December 06, 2018

March 29, 2018

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SUMITOMO METAL MINING CO (JP)

C25C7/02; C23F1/02; C25C1/08; C25D17/12

US20110233055A1	2011-09-29
JP2015196905A	2015-11-09
JPH10317197A	1998-12-02
JPS5136693B1	1976-10-09
JPS52152832A	1977-12-19
JPS5629960B2	1981-07-11

See also references of EP 3633074A4

SHOBAYASHI Masayuki et al. (JP)

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