Title:
CEDGE BOND MATERIAL, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/075193
Kind Code:
A1
Abstract:
The present invention provides an edge bond material which satisfies at least one of the requirements (1) to (3) described below. (1) The edge bond material contains a curable resin, while having a thixotropic index of 1.0 or more at a temperature of from 25°C to 50°C.
(2) The edge bond material contains an epoxy resin, a curing agent, an inorganic filler and a cyclic carbodiimide.
(3) The edge bond material contains an epoxy resin, a curing agent and an inorganic filler; and a cured product of the edge bond material has a glass transition temperature of 130°C or higher, a thermal expansion coefficient of 25 ppm/°C or less for the range of from 10°C to 30°C, and a thermal expansion coefficient of 80 ppm/°C or less for the range of from 180°C to 220°C, as determined by thermomechanical analysis.
Inventors:
SEKI KOHEI (JP)
Application Number:
PCT/JP2021/036241
Publication Date:
April 14, 2022
Filing Date:
September 30, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L23/29; C08G59/18; C08G59/50; C09J11/04; C09J11/06; C09J163/00; H01L21/52; H01L23/31
Domestic Patent References:
| WO2019138919A1 | 2019-07-18 | |||
| WO2019098053A1 | 2019-05-23 |
Foreign References:
| JP2018513891A | 2018-05-31 | |||
| JP2018518544A | 2018-07-12 | |||
| US20190157222A1 | 2019-05-23 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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