Title:
CERAMIC CIRCUIT SUBSTRATE AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/234286
Kind Code:
A1
Abstract:
Provided is a ceramic circuit substrate having a favorable adhesion with a mold resin. A ceramic circuit substrate according to an embodiment of the present invention comprises a ceramic substrate and a plurality of metal parts. The ceramic substrate has a first surface. The plurality of metal parts are respectively provided in a plurality of first regions of the first surface. The first surface has a second region positioned between the adjacent first regions. The average length RSm of roughness curve elements in the second region is 40 μm or more. The average length RSm is preferably 100 μm or less. The maximum peak height Rp of the roughness curve for the surface in the second region is preferably 1.0 μm or more. The maximum valley depth Rv of the roughness curve for the surface in the second region is preferably 1.0 μm or more.
Inventors:
SASAKI AKITO (JP)
IWAI KENTARO (JP)
KANAHARA KEITA (JP)
IWAI KENTARO (JP)
KANAHARA KEITA (JP)
Application Number:
PCT/JP2023/020064
Publication Date:
December 07, 2023
Filing Date:
May 30, 2023
Export Citation:
Assignee:
TOSHIBA KK (JP)
TOSHIBA MATERIALS CO LTD (JP)
TOSHIBA MATERIALS CO LTD (JP)
International Classes:
H01L23/13; H01L23/12; H05K1/02; H05K3/18; H05K3/28
Foreign References:
| JP2017011049A | 2017-01-12 | |||
| JP2021005785A | 2021-01-14 | |||
| JP2018202834A | 2018-12-27 |
Attorney, Agent or Firm:
iX patent law firm, P.C. (JP)
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