CERAMIC ELECTRONIC COMPONENT, PACKAGE, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT

WIPO Patent Application WO/2024/071420

A1

This ceramic electronic component is characterized by comprising: a laminated chip that has a substantially rectangular parallelepiped shape, that has layered alternately a plurality of dielectric layers and a plurality of internal electrode layers mainly made of Ni, and that is formed such that the internal electrode layers are alternately exposed to opposite first and second end surfaces of the substantially rectangular parallelepiped shape; and a pair of external electrodes that are provided to the first and second end surfaces and that have contact layers being in contact with the first and second end surfaces and being mainly made of Cu. The ceramic electronic component is also characterized in that a low melting metal having a lower melting point than that of Cu is added to the internal electrode layers and the contact layers, and in one or more of the internal electrode layers from the outermost layer of the internal electrode layers, the width of connection parts connected to the external electrodes is smaller than that in other regions.　

JPH05209919	POLARITY DETECTING METHOD FOR POLAR CAPACITOR
JPS56138997	CHIP-SHAPED ELECTRONIC PART ARRAY
JP2790224	ASSEMBLING METHOD OF ELECTROLYTIC CAPACITOR

KITAMURA SHOHEI (JP)
SHIROTA AYUMI (JP)
MATSUOKA AYUMI (JP)
ASAKO HIKARI (JP)

PCT/JP2023/035788

April 04, 2024

September 29, 2023

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TAIYO YUDEN KK (JP)

H01G13/00; H01G2/06; H01G4/30; H05K13/02

JP2012099786A	2012-05-24
JP2022133147A	2022-09-13
JP2022067608A	2022-05-06
JP2014112647A	2014-06-19

KATAYAMA, Shuhei (JP)

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