Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CERAMIC STRUCTURE AND SYSTEM FOR WAFER
Document Type and Number:
WIPO Patent Application WO/2021/095667
Kind Code:
A1
Abstract:
According to the present invention, a heater has a base body, a resistive heating body, and a terminal part. The base body is made of ceramic and has a plate shape. The resistive heating body is positioned inside the base body. The terminal part is electrically connected to the resistive heating body. The base body has, on the lower surface side thereof, a convex section that surrounds the terminal part. The convex section comprises a ceramic member, and the terminal part passes through a through-hole formed in the ceramic member. The ceramic member is bonded to at least one among the lower surface of the base body and the terminal part.

Inventors:
KAWANABE YASUNORI (JP)
MUNEISHI TAKESHI (JP)
KOMATSU YOSHIHIRO (JP)
OKAWA YOSHIHIRO (JP)
Application Number:
PCT/JP2020/041627
Publication Date:
May 20, 2021
Filing Date:
November 06, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KYOCERA CORP (JP)
International Classes:
C04B37/00; H05B3/02; H05B3/74
Domestic Patent References:
WO2018030433A12018-02-15
Foreign References:
JP2019079774A2019-05-23
JP2008297615A2008-12-11
JPH11220011A1999-08-10
JP2020191199A2020-11-26
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Download PDF: