Title:
CERAMIC SUBSTRATE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/235865
Kind Code:
A1
Abstract:
Disclosed is a ceramic substrate manufacturing method in which a copper sheet is etched and then bonded to a ceramic substrate, so that the ceramic substrate has reduced overall processing time and improved reliability and product lifespan. The disclosed ceramic substrate manufacturing method comprises the steps of: etching a copper sheet so as to prepare a metal substrate; etching a ceramic substrate so as to prepare a unit ceramic substrate; assembling the metal substrate and the unit ceramic substrate; bonding the metal substrate and the unit ceramic substrate so as to form a stack; partially printing a metal paste on the surface of the stack; and sintering the metal paste.
Inventors:
WOO KYUNG WHAN (KR)
LEE JI HYUNG (KR)
LEE JI HYUNG (KR)
Application Number:
PCT/KR2020/006364
Publication Date:
November 26, 2020
Filing Date:
May 14, 2020
Export Citation:
Assignee:
AMOSENSE CO LTD (KR)
International Classes:
H05K3/46; H05K1/03; H05K3/06; H05K3/18
Foreign References:
| JP3949270B2 | 2007-07-25 | |||
| KR20180113050A | 2018-10-15 | |||
| JPH10215053A | 1998-08-11 | |||
| JP2007311441A | 2007-11-29 | |||
| EP1699080A1 | 2006-09-06 |
Attorney, Agent or Firm:
KIM, Churchill (KR)
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