Title:
CHAMBER PRESSURE CONTROL METHOD AND APPARATUS, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/211440
Kind Code:
A1
Abstract:
A chamber pressure control method and apparatus, and a semiconductor device, capable of precisely and rapidly controlling the pressure inside a chamber to stabilise same within a preset range, thereby improving the processing quality and product yield. The method comprises the following steps: S1: detecting the actual pressure value inside a chamber; S2: calculating the difference between the actual pressure value and a preset target pressure value; determining whether the difference exceeds a preset range and, if so, then implementing step S3; and, if not, then the process finishes; S3: acquiring a control coefficient, the control coefficient being the product of a curvature and a preset PID coefficient, and the curvature being the curvature corresponding to a current position parameter value of an execution unit in a curve relating to pressure and position parameters corresponding to a current gas flow value; S4: on the basis of the difference and the control coefficient, calculating a position parameter adjustment amount of the execution unit and outputting same to the execution unit, and returning to step S2.
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Inventors:
ZHENG WENNING (CN)
ZHAO DI (CN)
CHEN ZHENGTANG (CN)
ZHAO DI (CN)
CHEN ZHENGTANG (CN)
Application Number:
PCT/CN2019/127864
Publication Date:
October 22, 2020
Filing Date:
December 24, 2019
Export Citation:
Assignee:
BEIJING SEVENSTAR FLOW CO LTD (CN)
International Classes:
H01L21/67; G05D16/20
Foreign References:
CN103309369A | 2013-09-18 | |||
CN104991581A | 2015-10-21 | |||
CN102854902A | 2013-01-02 | |||
JP2018112933A | 2018-07-19 |
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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