CHEMICAL MECHANICAL PLANARIZATION (CMP) PAD CONDITIONER AND METHOD OF MAKING

Title:

CHEMICAL MECHANICAL PLANARIZATION (CMP) PAD CONDITIONER AND METHOD OF MAKING

Document Type and Number:

WIPO Patent Application WO/2012/082702

Kind Code:

A3

Abstract:

A method of forming a chemical mechanical planarization (CMP) pad conditioner includes placing abrasive grains on a major surface of a substrate, forming a binding composition at an exterior surface of the abrasive grains, and depositing a bonding layer over the surface of the substrate and a portion of the abrasive grains to secure the abrasive grains to the major surface of the substrate.

Inventors:

WU JIANHUI (US)
SCHULZ ERIC M (US)
RAMANATH SRINIVASAN (US)
KHAUND ARUP K (US)

Application Number:

PCT/US2011/064565

Publication Date:

January 24, 2013

Filing Date:

December 13, 2011

Export Citation:

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Assignee:

SAINT GOBAIN ABRASIFS SA (FR)
SAINT GOBAIN ABRASIVES INC (US)

International Classes:

H01L21/304

Foreign References:

US20050095959A1	2005-05-05
US20050276979A1	2005-12-15
US20090224370A1	2009-09-10
KR20020036138A	2002-05-16

Attorney, Agent or Firm:

NOE, Jr., Michael, E. et al. (7300 FM 2222 Bldg. 1 Ste. 210Austin, Texas, US)

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