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Title:
CHEMICAL MECHANICAL PLANARIZATION PAD
Document Type and Number:
WIPO Patent Application WO2005049269
Kind Code:
A3
Abstract:
A chemical Mechanical Planarization (CMP) Pad. The CMP pad may be hydrophobic due to the incorporation of metal complexing agents. The CMP pad substantially retaining planarization characteristics throughout planarization applications. Shearing, hardness, wearing, water absorbtion and electrical characteristics of the CMP pad remain substantially constant during CMP applications.

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Inventors:
BAUM THOMAS H (US)
Application Number:
PCT/US2004/038043
Publication Date:
July 13, 2006
Filing Date:
November 15, 2004
Export Citation:
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Assignee:
ADVANCED TECH MATERIALS (US)
BAUM THOMAS H (US)
International Classes:
H01L21/302; H01L21/321; H01L21/461; B24B
Foreign References:
US6337281B12002-01-08
US6354929B12002-03-12
US6477926B12002-11-12
US20020004357A12002-01-10
US5934980A1999-08-10
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