Title:
CHEMICAL MECHANICAL POLISHING DEVICE FOR POLISHING WORK PIECE
Document Type and Number:
WIPO Patent Application WO/2016/068327
Kind Code:
A1
Abstract:
The present invention pertains to a chemical mechanical polishing (CMP) device for polishing a work piece such as a metal case to provide the same with a mirroring finish. The chemical mechanical polishing device is provided with the following: a polishing pad (2) having a ring-shaped polishing surface (2a) that has a curved vertical cross-section; a work piece retaining section (11) that retains a polygonal work piece (W); a rotating device (15) that rotates the work piece retaining section (11) about the center axis of the work piece (W); a pressing device (14) that presses the peripheral edge of the work piece (W) against the ring-shaped polishing surface (2a); and an operation control unit (25) that, according to the rotational angle of the work piece (W), varies the speed by which the rotating device (15) rotates the work piece (W). The pressing device (14) is disposed at a location further inside than the work piece retaining section (11) in the radial direction of a polishing table (3).
Inventors:
ISHII YU (JP)
ITO KENYA (JP)
MORINAGA HITOSHI (JP)
TAMAI KAZUSEI (JP)
OHTSUKI SHINGO (JP)
ASANO HIROSHI (JP)
ITO KENYA (JP)
MORINAGA HITOSHI (JP)
TAMAI KAZUSEI (JP)
OHTSUKI SHINGO (JP)
ASANO HIROSHI (JP)
Application Number:
PCT/JP2015/080823
Publication Date:
May 06, 2016
Filing Date:
October 30, 2015
Export Citation:
Assignee:
EBARA CORP (JP)
FUJIMI INC (JP)
FUJIMI INC (JP)
International Classes:
B24B37/02; B23B29/00; B24B9/00; B24B37/27
Foreign References:
| JP2004154880A | 2004-06-03 | |||
| JPH10100050A | 1998-04-21 | |||
| JPH079322A | 1995-01-13 |
Attorney, Agent or Firm:
WATANABE, Isamu et al. (JP)
Isamu Watanabe (JP)
Isamu Watanabe (JP)
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