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Title:
CHEMICAL-MECHANICAL POLISHING LIQUID FOR FLATTENING BARRIER LAYER
Document Type and Number:
WIPO Patent Application WO/2018/120809
Kind Code:
A1
Abstract:
The present invention provides a chemical-mechanical polishing liquid for flattening a barrier layer, comprising: abrasive particles, an azole compound, a complexing agent, a nonionic surfactant, and an oxidizing agent. The nonionic surfactant is polyethyleneglycol. The chemical-mechanical polishing liquid has high removal rate for barrier layer and dielectric layer materials under a mild condition, has adjustable removal rate for low dielectric materials and copper, can effectively control generation of dishing, dielectric layer erosion, and metal erosion in the polishing process, can reduce surface contaminants, and therefore has excellent market application prospect.

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Inventors:
PAN YIJUN (CN)
JING JIANFEN (CN)
YAO YING (CN)
DU LINGXI (CN)
YANG JUNYA (CN)
ZHANG JIAN (CN)
CAI XINYUAN (CN)
SONG KAI (CN)
WANG YUCHUN (CN)
Application Number:
PCT/CN2017/094313
Publication Date:
July 05, 2018
Filing Date:
July 25, 2017
Export Citation:
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Assignee:
ANJI MICROELECTRONICS TECH SHANGHAI CO LTD (CN)
International Classes:
C09G1/02
Foreign References:
CN101130665A2008-02-27
CN101407699A2009-04-15
CN101541913A2009-09-23
Attorney, Agent or Firm:
BEIJING DACHENG LAW OFFICES, LLP (CN)
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