Title:
CHEMICAL MECHANICAL POLISHING PADS COMPRISING LIQUID ORGANIC MATERIAL CORE ENCAPSULATED IN POLYMER SHELL AND METHODS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO2008013377
Kind Code:
A9
Abstract:
There is provided a chemical mechanical polishing (CMP) pad including a core of a polymer shell encapsulating a liquid organic material having one of a boiling point and a decomposition point of 130 0C or more in a polymer matrix, the CMP pad having open pores formed by the core on a polishing surface thereof, and a method of producing the CMP pad. The CMP pad having a high hardness and a high density improves polishing efficiency and flatness of a wafer and maintains a uniform size of the core, thereby producing pads having high polishing efficiency and stable polishing performance.
Inventors:
JUN SUNG-MIN (KR)
LIM JONG-SOO (KR)
BAE SEUNG-HUN (KR)
LEE JU-YEOL (KR)
PARK IN-HA (KR)
LIM JONG-SOO (KR)
BAE SEUNG-HUN (KR)
LEE JU-YEOL (KR)
PARK IN-HA (KR)
Application Number:
PCT/KR2007/003513
Publication Date:
November 20, 2008
Filing Date:
July 20, 2007
Export Citation:
Assignee:
SKC CO LTD (KR)
JUN SUNG-MIN (KR)
LIM JONG-SOO (KR)
BAE SEUNG-HUN (KR)
LEE JU-YEOL (KR)
PARK IN-HA (KR)
JUN SUNG-MIN (KR)
LIM JONG-SOO (KR)
BAE SEUNG-HUN (KR)
LEE JU-YEOL (KR)
PARK IN-HA (KR)
International Classes:
B24D3/00
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