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Title:
CHEMICAL SOLUTION ACCOMMODATING BODY
Document Type and Number:
WIPO Patent Application WO/2019/049770
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a chemical solution accommodating body in which, when an accommodated chemical solution is used after storage for a fixed period of time, in a wiring formation step that includes photolithography, shortcircuits as well as defects are less likely to occur in the wiring substrate that is formed. This chemical solution accommodating body comprises a container and a chemical solution that is accommodated in the container. The chemical solution contains at least one type of specific metal component selected from a group consisting of Fe, Al, Cr and Ni. The content amount of the specific metal component in the chemical solution is 100 mass ppt or less per the total mass of the chemical solution. At least a portion of a solution contact part of the container comprises glass containing sodium atoms, and in at least a portion of the solution contact part, a content mass ratio A/B of a content amount A of sodium atoms in a surface region with respect to the total mass of the surface region, to a content amount B of sodium atoms in a bulk region with respect to the total mass of the bulk region, is greater than 0.10 and less than 1.0.

Inventors:
KAMIMURA TETSUYA (JP)
YOSHIDOME MASAHIRO (JP)
KAWADA YUKIHISA (JP)
Application Number:
PCT/JP2018/032173
Publication Date:
March 14, 2019
Filing Date:
August 30, 2018
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C03C23/00; B65D23/02; C03C17/245
Foreign References:
JP2005170736A2005-06-30
JP2012501940A2012-01-26
JP2001294447A2001-10-23
JP2013047111A2013-03-07
JPH11278875A1999-10-12
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
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