CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE RESIN COMPOSITION

Title:

CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2004/038506

Kind Code:

A1

Abstract:

A chemically amplified positive photosensitive resin composition capable of forming thick or extra thick resist patterns, which comprises (A) an alkali-soluble novolac resin, (B) an alkali-soluble acrylic resin, (C) an acetal compound, and (D) an acid generator and which are suitable for the formation of thick resist patterns necessary to the formation of magnetic poles of magnetic heads or bumps. The acetal compound is preferably a polycondensate comprising repeating units represented by the general formula (I) (wherein R is saturated alkyl having 1 to 20 carbon atoms; and n is an integer of 1 to 10).

Inventors:

NISHIWAKI YOSHINORI (JP)
MAKII TOSHIMICHI (JP)

Application Number:

PCT/JP2003/013233

Publication Date:

May 06, 2004

Filing Date:

October 16, 2003

Export Citation:

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Assignee:

CLARIANT INT LTD (CH)
CLARIANT JAPAN K K (JP)
NISHIWAKI YOSHINORI (JP)
MAKII TOSHIMICHI (JP)

International Classes:

G03C1/492; G03F7/004; G03F7/027; G03F7/039; (IPC1-7): G03F7/039

Foreign References:

US4247611A	1981-01-27
US4678737A	1987-07-07
JPH1195435A	1999-04-09
EP0520654A1	1992-12-30
JP2002229190A	2002-08-14
JP2001312060A	2001-11-09
JP2001281863A	2001-10-10
JP2002006503A	2002-01-09

Other References: