Title:
CHIP ARRAY AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/109411
Kind Code:
A1
Abstract:
The present disclosure relates to a chip array and an electronic device. The chip array comprises: a computing power board and at least two types of chips, wherein the first type of chips of the at least two types of chips are arranged in a first area of the computing power board, and the second type of chips of the at least two types of chips are arranged in a second area of the computing power board, and the power consumption of the first type of chips is greater than the power consumption of the second type of chips; and the heat dissipation priority of the first area is greater than the heat dissipation priority of the second area.
Inventors:
WU CHAO (CN)
Application Number:
PCT/CN2022/132170
Publication Date:
June 22, 2023
Filing Date:
November 16, 2022
Export Citation:
Assignee:
BITMAIN TECH INC (CN)
International Classes:
H01L23/367; H01L23/467; H01L23/473
Domestic Patent References:
| WO2016192482A1 | 2016-12-08 |
Foreign References:
| CN114373725A | 2022-04-19 | |||
| CN112492862A | 2021-03-12 | |||
| CN113126723A | 2021-07-16 | |||
| CN110764598A | 2020-02-07 |
Attorney, Agent or Firm:
BEIJING SHINING-IP FIRM (CN)
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