Title:
CHIP, CHIP ASSEMBLY, CORE AND INTERCOOLER
Document Type and Number:
WIPO Patent Application WO/2021/136437
Kind Code:
A1
Abstract:
The present disclosure relates to the technical field of heat exchange devices, and specifically relates to a chip, a chip assembly, a core and an intercooler. The chip has a first flange and a first plate surface used for making contact with a cooled medium. The first flange is formed on the first plate surface and extends in a first direction. A raised part and a cooled medium flow channel are formed on the first plate surface. The raised part is located between the first flange and the cooled medium flow channel in a second direction. A blocking part used for blocking the cooled medium is formed between the first flange and the raised part. The first direction is the extension direction of the cooled medium flow channel, and the second direction is parallel to the first plate surface and is perpendicular to the first direction. The chip, the chip assembly, the core and the intercooler provided by the present disclosure may improve the problem of poor heat exchange performance of existing intercoolers.
Inventors:
LI TIAN (CN)
TANG PINGQIANG (CN)
XIE JIAN (CN)
LIU WEIFENG (CN)
XIE XIANLONG (CN)
CHEN XIAOFENG (CN)
WANG QIANG (CN)
WANG QING (CN)
TANG PINGQIANG (CN)
XIE JIAN (CN)
LIU WEIFENG (CN)
XIE XIANLONG (CN)
CHEN XIAOFENG (CN)
WANG QIANG (CN)
WANG QING (CN)
Application Number:
PCT/CN2020/141663
Publication Date:
July 08, 2021
Filing Date:
December 30, 2020
Export Citation:
Assignee:
ZHEJIANG YINLUN MACHINERY CO (CN)
International Classes:
F28F3/08; F28D9/00
Foreign References:
| CN111029316A | 2020-04-17 | |||
| CN211238221U | 2020-08-11 | |||
| CN110375573A | 2019-10-25 | |||
| KR20010108765A | 2001-12-08 | |||
| CN107782179A | 2018-03-09 |
Other References:
See also references of EP 4086561A4
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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