Title:
CHIP AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/196600
Kind Code:
A1
Abstract:
Provided is a chip, comprising a substrate, a bare chip, and a solder ball set soldered between the substrate and the bare chip. The solder ball set comprises a first solder ball and a second solder ball spaced apart from each other; a first conductive portion connecting the first solder ball to the second solder ball is arranged on the bare chip; a second conductive portion connecting the first solder ball to the second solder ball is arranged on the substrate; the first solder ball, the first conductive portion, the second solder ball and the second conductive portion form a closed loop; and the bare chip further comprises two inductors distributed at two sides of the closed loop. The chip can ameliorate the crosstalk phenomenon between adjacent inductors. A communication device is further provided.
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Inventors:
LIU NING (CN)
CHEN ZHAO (CN)
CHEN ZHAO (CN)
Application Number:
PCT/CN2019/078567
Publication Date:
October 17, 2019
Filing Date:
March 18, 2019
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/552
Foreign References:
| CN106935572A | 2017-07-07 | |||
| CN1938850A | 2007-03-28 | |||
| CN103379733A | 2013-10-30 | |||
| US20170098603A1 | 2017-04-06 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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