Title:
CHIP DAMAGE DETECTION DEVICE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2011/089462
Kind Code:
A8
Abstract:
A chip damage detection device (10), comprising at least one bi-stable circuit (12) comprises a first conductive line (14) passing through an observed area (16, 18, 34) of a semiconductor integrated circuit chip (20) for damage monitoring of the observed area. The at least one bi-stable circuit is arranged to flip from a first into a second stable state when a potential difference between a first end (22) and a second end (24) of the first conductive line changes or when a leakage current overdrives a state keeping current at the first conductive line. Further, a semiconductor integrated circuit device (60) comprises a chip damage detection device (10), and a safety critical system (70) comprises the semiconductor integrated circuit device (60) or the chip damage detection circuit (10).
Inventors:
HEMON ERWAN (FR)
LANCE PHILIPPE (FR)
NEUGEBAUER KURT (DE)
LANCE PHILIPPE (FR)
NEUGEBAUER KURT (DE)
Application Number:
PCT/IB2010/000606
Publication Date:
August 16, 2012
Filing Date:
January 21, 2010
Export Citation:
Assignee:
FREESCALE SEMICONDUCTOR INC (US)
HEMON ERWAN (FR)
LANCE PHILIPPE (FR)
NEUGEBAUER KURT (DE)
HEMON ERWAN (FR)
LANCE PHILIPPE (FR)
NEUGEBAUER KURT (DE)
International Classes:
G01R31/317; G01R31/28
Download PDF: