Title:
CHIP AND ELECTRICAL EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2020/093277
Kind Code:
A1
Abstract:
A chip and electrical equipment. The chip comprises a substrate (20) and a wafer (10) mounted on the substrate (20); the wafer (10) is provided with a first power supply area (101) and a second power supply area (102) which are arranged at an interval; the first power supply area (101) comprises first bonding pads (1011) and second bonding pads (1012); the second power supply area (102) comprises second bonding pads (1021) and third bonding pads (1022); the wafer (10) is disposed on the mounting surface of the substrate (20); the substrate (20) comprises a bottom metal plate (205) away from the mounting surface, at least one middle metal plate arranged parallel to and spaced apart from the bottom metal plate (205), and an insulating plate disposed between adjacent metal plates; the bottom metal plate (205) is provided with power supply pins (2051), grounding pins (2052), and first power supply pins (2053); the second bonding pads (1012) in the first power supply area (101) are connected to the second bonding pads (1021) in the second power supply area (102) by means of a first circuit (2041) located on the middle metal plate, and the first circuit (2041) is electrically connected to the first power supply pins (2053) by means of a first connecting hole. The second bonding pads (1012) in the first power supply area (101) and the second bonding pads (1021) in the second power supply area (102) are connected to the first power supply pins (2053), so that the number of the power supply pins on the substrate (20) can be reduced, the structure of the chip is simplified, and the production costs of the chip are reduced.
Inventors:
YANG SHUAI (CN)
GUO HAN (CN)
GUO HAN (CN)
Application Number:
PCT/CN2018/114390
Publication Date:
May 14, 2020
Filing Date:
November 07, 2018
Export Citation:
Assignee:
BITMAIN TECH INC (CN)
International Classes:
H01L23/482
Foreign References:
| US20040166659A1 | 2004-08-26 | |||
| CN1470070A | 2004-01-21 | |||
| CN108461478A | 2018-08-28 | |||
| CN101131976A | 2008-02-27 | |||
| US20030080400A1 | 2003-05-01 |
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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