Title:
CHIP-ON-FILM PACKAGING STRUCTURE AND CHIP-ON-FILM PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/036763
Kind Code:
A1
Abstract:
Provided are a chip-on-film packaging structure and a chip-on-film packaging method. The chip-on-film packaging structure comprises a flexible substrate and a chip. The flexible substrate comprises a first recess formed on a first surface of the flexible substrate, protrusions provided in the first recess, and substrate bonding pads provided in the first recess. The chip comprises second recesses formed on a second surface of the chip, and chip bonding pads corresponding to the substrate bonding pads and provided on the second surface. The first recess of the flexible substrate fit the peripheral shape of the chip, and the second recesses fit the protrusions of the first recess, so that the chip is embedded in the flexible substrate. The chip bonding pads and the substrate bonding pads are electrically connected.
Inventors:
CHEN YICHENG (CN)
WEN HONG (CN)
WEN HONG (CN)
Application Number:
PCT/CN2020/113231
Publication Date:
February 24, 2022
Filing Date:
September 03, 2020
Export Citation:
Assignee:
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
H01L21/48; H01L23/498; H01L21/60
Foreign References:
| CN101295682A | 2008-10-29 | |||
| CN101483158A | 2009-07-15 | |||
| US6838758B1 | 2005-01-04 | |||
| US20140264860A1 | 2014-09-18 | |||
| CN1532921A | 2004-09-29 | |||
| CN110379312A | 2019-10-25 |
Attorney, Agent or Firm:
PURPLEVINE INTELLECTUAL PROPERTY (SHENZHEN) CO., LTD. (CN)
Download PDF: