Title:
CHIP PACKAGING METHOD AND PACKAGE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/037574
Kind Code:
A1
Abstract:
A chip packaging method and package structure, the package structure comprising a substrate (200), a sensing chip (201) coupled to the substrate (200), a plastic package layer (202) located on the substrate (200), and a covering layer (203) located on the plastic package layer (202) and a first surface (210) of the sensing chip (201); the sensing chip (201) comprises the first surface (210) and a second surface (220) opposite to the first surface (210), and further comprises a sensing area (211) located on the first surface (210); the second surface (220) of the sensing chip (201) faces towards the substrate (200); and the plastic package layer (202) encloses the sensing chip (201), and the surface of the plastic package layer (202) is flush with the first surface (210) of the sensing chip (201).
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Inventors:
WANG ZHIQI (CN)
YU QIONG (CN)
WANG WEI (CN)
YU QIONG (CN)
WANG WEI (CN)
Application Number:
PCT/CN2015/089304
Publication Date:
March 17, 2016
Filing Date:
September 10, 2015
Export Citation:
Assignee:
CHINA WAFER LEVEL CSP CO LTD (CN)
International Classes:
H01L21/60; H01L21/56; H01L23/31; H01L23/498
Foreign References:
| CN103715149A | 2014-04-09 | |||
| CN1533741A | 2004-10-06 | |||
| CN104201116A | 2014-12-10 | |||
| CN204179070U | 2015-02-25 | |||
| CN104850840A | 2015-08-19 | |||
| CN104600055A | 2015-05-06 | |||
| CN101188202A | 2008-05-28 | |||
| CN101047153A | 2007-10-03 | |||
| CN203521394U | 2014-04-02 | |||
| US20080296716A1 | 2008-12-04 | |||
| US20090051052A1 | 2009-02-26 |
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
北京集佳知识产权代理有限公司 (CN)
北京集佳知识产权代理有限公司 (CN)
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