Title:
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/145852
Kind Code:
A1
Abstract:
Disclosed are a packaging method and a packaging structure. The packaging method comprises: providing a first substrate and a second substrate, the second substrate having a first surface and a second surface opposite to the first surface, and a side surface of the first substrate being adhered to the first surface of the second substrate via an adhesive layer; forming a groove structure on the second surface of the second substrate; providing a base, the base having a first surface and a second surface opposite to the first surface, and the first surface of the base having a sensing area and a plurality of welding pads located around the sensing area; and laminating the second surface of the second substrate with the first surface of the base to form a cavity between the groove structure and the base, such that the sensing area is located inside the cavity.
Inventors:
WANG ZHIQI (CN)
YANG YING (CN)
WANG WEI (CN)
YANG YING (CN)
WANG WEI (CN)
Application Number:
PCT/CN2015/092614
Publication Date:
September 22, 2016
Filing Date:
October 23, 2015
Export Citation:
Assignee:
CHINA WAFER LEVEL CSP CO LTD (CN)
International Classes:
H01L25/04; H01L23/29; H01L23/488
Foreign References:
| CN101789420A | 2010-07-28 | |||
| JP2004312008A | 2004-11-04 | |||
| CN1438684A | 2003-08-27 | |||
| US20120292788A1 | 2012-11-22 | |||
| CN104835808A | 2015-08-12 |
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
北京集佳知识产权代理有限公司 (CN)
北京集佳知识产权代理有限公司 (CN)
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