Title:
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/073401
Kind Code:
A1
Abstract:
Provided are a chip packaging method and a chip packaging structure. A passivation layer is provided on a pad of a wafer, a first metal bonding layer is then formed on the passivation layer, a second metal bonding layer is formed on a substrate, the substrate and the wafer are bonded and packaged together through bonding of the first metal bonding layer and the second metal bonding layer, a first shielding layer is provided on the substrate, and the first shielding layer is connected to the second metal bonding layer; and after the wafer and the substrate are bonded, semi-cutting is performed on the wafer until the first metal bonding layer is exposed, and a second shielding layer is then formed, and the second shielding layer is electrically connected to the first metal bonding layer, such that an electromagnetic shielding structure jointly composed of the first shielding layer, the second metal bonding layer, the second shielding layer and the first metal bonding layer is obtained. The shielding structure is thus approximately closed, thereby improving the electromagnetic shielding effect.
Inventors:
LI LINPING (CN)
SHENG JINGHAO (CN)
JIANG ZHOU (CN)
SHENG JINGHAO (CN)
JIANG ZHOU (CN)
Application Number:
PCT/CN2020/117655
Publication Date:
April 22, 2021
Filing Date:
September 25, 2020
Export Citation:
Assignee:
HANGZHOU JWL TECH INC (CN)
International Classes:
H01L23/552; H01L21/60; H01L23/485
Domestic Patent References:
| WO2015145623A1 | 2015-10-01 |
Foreign References:
| CN110676244A | 2020-01-10 | |||
| US20040166662A1 | 2004-08-26 | |||
| US9478599B1 | 2016-10-25 | |||
| CN104140072A | 2014-11-12 | |||
| CN201910978107A | 2019-10-15 |
Other References:
See also references of EP 3929978A4
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
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