Title:
CHIP PACKAGING STRUCTURE AND PHOTOELECTRIC APPARATUS THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/109266
Kind Code:
A1
Abstract:
Disclosed in the present application are a chip packaging structure and a photoelectric apparatus thereof. The chip packaging structure comprises: a CPA substrate (100), wherein the CPA substrate (100) is provided with a first through hole (110); a CPO (200), wherein the CPO (200) is packaged on a first surface of the CPA substrate (100); and an ASIC chip (300), wherein the ASIC chip (300) is packaged on a second surface of the CPA substrate (100), the first surface is located on an opposite side of the second surface, and the ASIC chip (300) is electrically connected to the CPO (200) by means of the first through hole (110).
Inventors:
TANG NINGFENG (CN)
Application Number:
PCT/CN2022/124162
Publication Date:
June 22, 2023
Filing Date:
October 09, 2022
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
H01L25/16; H01L23/14; H01L23/367; H04B10/25
Foreign References:
| US10866376B1 | 2020-12-15 | |||
| CN111934189A | 2020-11-13 | |||
| US20210257396A1 | 2021-08-19 | |||
| CN113759477A | 2021-12-07 | |||
| CN107720689A | 2018-02-23 | |||
| CN113227864A | 2021-08-06 |
Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
Download PDF: