Title:
CHIP PAD WINDOWING METHOD, AND CHIP
Document Type and Number:
WIPO Patent Application WO/2021/082015
Kind Code:
A1
Abstract:
Embodiments of the present application disclose a chip pad windowing method, and a chip. The method comprises: using a photolithographic process to prepare an i-th functional layer located above a chip, wherein the i-th functional layer does not cover a pad windowing region of the chip, and where i is a positive integer less than N, and N is an integer greater than 1; filling the pad windowing region of the chip with a dissolvable layer; using a photolithographic process to prepare, on an (N - 1)-th functional layer located above the chip and above the filled-in pad windowing region, an N-th functional layer located above the chip, wherein the N-th functional layer does not cover the pad windowing region of the chip; and using a solvent to dissolve the dissolvable layer to acquire a pad window of the chip. The technical solutions of the embodiments of the present application improve the efficiency of pad windowing, thereby improving chip yield.
Inventors:
LAN YANG (CN)
SHEN JIAN (CN)
YAO GUOFENG (CN)
WANG WENXUAN (CN)
SHEN JIAN (CN)
YAO GUOFENG (CN)
WANG WENXUAN (CN)
Application Number:
PCT/CN2019/115159
Publication Date:
May 06, 2021
Filing Date:
November 01, 2019
Export Citation:
Assignee:
SHENZHEN GOODIX TECH CO LTD (CN)
International Classes:
H01L27/146
Foreign References:
| CN101471295A | 2009-07-01 | |||
| JP2000196053A | 2000-07-14 | |||
| KR100843967B1 | 2008-07-03 | |||
| CN102194836A | 2011-09-21 | |||
| US20090321862A1 | 2009-12-31 |
Attorney, Agent or Firm:
LONGSUN LEAD IP LTD. (CN)
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