Title:
CHIP PERIPHERY PEELING APPARATUS, CHIP SUPPLY APPARATUS, CHIP SUPPLY SYSTEM, CHIP BONDING SYSTEM, PICKUP APPARATUS, CHIP PERIPHERY PEELING METHOD, CHIP SUPPLY METHOD, CHIP BONDING METHOD, AND PICKUP METHOD
Document Type and Number:
WIPO Patent Application WO/2023/100831
Kind Code:
A1
Abstract:
A chip periphery peeling apparatus (50) comprises: a frame support unit (521) that supports an annular frame (RI2, RI3) on which a sheet (TE) having a plurality of chips (CP) affixed thereto is fixed; and a chip periphery peeling unit (57) that makes both peripheral ends of each of the plurality of chips (CP) opposite each other across at least the center of each of the plurality of chips (CP) affixed to the sheet (TE) more readily peelable from the sheet (TE) compared to the center.
Inventors:
YAMAUCHI AKIRA (JP)
Application Number:
PCT/JP2022/043849
Publication Date:
June 08, 2023
Filing Date:
November 29, 2022
Export Citation:
Assignee:
BONDTECH CO LTD (JP)
International Classes:
H01L21/301; H01L21/52; H01L21/67
Domestic Patent References:
| WO2004100240A1 | 2004-11-18 | |||
| WO2021100185A1 | 2021-05-27 |
Foreign References:
| JP2011216529A | 2011-10-27 | |||
| JP2012164844A | 2012-08-30 | |||
| JP2000252305A | 2000-09-14 | |||
| JPH06302630A | 1994-10-28 | |||
| JP2020177963A | 2020-10-29 | |||
| JP2001185565A | 2001-07-06 |
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
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