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Patent Searching and Data


Title:
CHIP PLATFORM UPGRADE METHOD AND RELATED DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/098015
Kind Code:
A1
Abstract:
The embodiments of the present application provide a chip platform upgrade method and a related device, which are applied to an electronic apparatus, wherein the electronic apparatus is installed with a chip platform upgrade program, and the chip platform upgrade program is used for being connected to at least one chip platform, and comprises a first process. The method comprises: creating a first thread and a second thread by means of a first process; by means of the first thread and according to a correspondence between chip platforms and interface functions, determining a first interface function corresponding to a first chip platform, and calling the first interface function, wherein the first interface function is used for firmware upgrade of the first chip platform, and the first chip platform is any one of at least one chip platform; and when the firmware upgrade succeeds, testing, by means of the second thread, the first chip platform to obtain test information.

Inventors:
ZUO ZHIJING (CN)
Application Number:
PCT/CN2022/098113
Publication Date:
June 08, 2023
Filing Date:
June 10, 2022
Export Citation:
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Assignee:
FIBOCOM WIRELESS INC (CN)
International Classes:
G06F8/65
Foreign References:
CN107194242A2017-09-22
CN112100015A2020-12-18
CN114296754A2022-04-08
CN114003257A2022-02-01
US20140281577A12014-09-18
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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