Title:
CHIP PROTECTIVE FILM AND PREPARATION METHOD THEREFOR, AND CHIP
Document Type and Number:
WIPO Patent Application WO/2024/007649
Kind Code:
A1
Abstract:
The present disclosure provides a chip protective film and a preparation method therefor, and a chip, and belongs to the technical field of electronic chip protective thin films. The chip protective film comprises: a first protective layer; and a second protective layer, which is adhered to at least part of the surface of the first protective layer, wherein the second protective layer comprises the following components, in percentages by mass: 90-97% of an acrylate compound, 0.1-5% of a fluorine-containing compound, and a second auxiliary agent. The chip protective film has the characteristics of a high adhesive force, a small friction coefficient, a high hardness and good scratch resistance, etc., and effectively solves the technical problem of the existing chip protective film being not resistant to scratching.
More Like This:
Inventors:
WU DE (CN)
LIAO SHUHANG (CN)
ZHANG LIU (CN)
SU JUNXING (CN)
LIAO SHUHANG (CN)
ZHANG LIU (CN)
SU JUNXING (CN)
Application Number:
PCT/CN2023/087229
Publication Date:
January 11, 2024
Filing Date:
April 10, 2023
Export Citation:
Assignee:
WUHAN CHOICE TECH CO LTD (CN)
International Classes:
C09J7/24; B32B27/38
Foreign References:
| CN114292615A | 2022-04-08 | |||
| CN114621669A | 2022-06-14 | |||
| CN114854320A | 2022-08-05 |
Attorney, Agent or Firm:
BEIJING ZHONGDA DEQUAN IP AGENCY CO., LTD. (CN)
Download PDF: