Title:
CHIP RESISTOR AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2017/130876
Kind Code:
A1
Abstract:
Provided is a thin-film chip resistor comprising: an insulating substrate; a thin-film resistance element formed on the substrate; a pair of electrodes connected to the thin-film resistance element; and a protective film covering at least the thin-film resistance element, between the pair of electrodes. The protective film comprises: a first protective film formed from silicon nitride which comes into contact with the thin-film resistance element; and a second protective film formed from silicon oxide which comes into contact the first protective film.
Inventors:
HIROSHIMA YASUSHI (JP)
Application Number:
PCT/JP2017/002050
Publication Date:
August 03, 2017
Filing Date:
January 23, 2017
Export Citation:
Assignee:
KOA CORP (JP)
International Classes:
H01C1/032; H01C7/00; H01C17/00
Foreign References:
| JP2004140285A | 2004-05-13 | |||
| JP2009302082A | 2009-12-24 | |||
| JP2015153814A | 2015-08-24 | |||
| JP2012096350A | 2012-05-24 | |||
| JPH06291260A | 1994-10-18 |
Attorney, Agent or Firm:
HIRAKI Yusuke et al. (JP)
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