Title:
CHIP RESISTOR
Document Type and Number:
WIPO Patent Application WO/2016/181737
Kind Code:
A1
Abstract:
Provided is a chip resistor in which cracking, fracturing, etc., as caused by thermal stress in a solder joint part can be reliably prevented. The chip resistor 1 is provided with a ceramic substrate 2 in the form of a rectangular prism, a pair of obverse electrodes 3 provided at both longitudinal end parts of the obverse surface of the ceramic substrate 2, a resistor 4 for connecting the two obverse electrodes 3, a protective layer 5 for covering the resistor 4, a pair of reverse electrodes 6 provided at both longitudinal end parts of the reverse surface of the ceramic substrate 2, end surface electrodes 7 for energizing the obverse electrodes 3 and the reverse electrodes 6, external electrodes 8 for covering the end surface electrodes 7, and a pair of insulating resin layers 9 provided so as to cover the edge part side of the reverse electrodes 6. The insulating resin layers 9 face each other on the reverse surface of the ceramic substrate 2 across a predetermined gap, and at least the mutually facing end parts of the insulating resin layers 9 are exposed from the external electrodes 8.
Inventors:
AKAHANE YASUSHI (JP)
CHIHARA SHINSUKE (JP)
CHIHARA SHINSUKE (JP)
Application Number:
PCT/JP2016/061699
Publication Date:
November 17, 2016
Filing Date:
April 11, 2016
Export Citation:
Assignee:
KOA CORP (JP)
International Classes:
H01C7/00
Foreign References:
| JP2008084905A | 2008-04-10 | |||
| JPH09180957A | 1997-07-11 | |||
| JP2015070166A | 2015-04-13 | |||
| JPH10256001A | 1998-09-25 |
Attorney, Agent or Firm:
The Patent Body Corporate TAKEWA INTERNATIONAL PATENT OFFICE (JP)
Patent business corporation Takekazu international patent firm (JP)
Patent business corporation Takekazu international patent firm (JP)
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