Title:
CHIP RESISTOR
Document Type and Number:
WIPO Patent Application WO/2023/079876
Kind Code:
A1
Abstract:
A chip resistor according to the present invention is provided with: an insulating substrate which has a first main surface that is an end face of the chip resistor in the thickness direction, and a first lateral surface and a second lateral surface that are end faces of the chip resistor in the longitudinal direction; a first surface electrode which is arranged on the first lateral surface-side end of the first main surface; a second surface electrode which is arranged on the second lateral surface-side end of the first main surface; a resistor which is arranged on the first main surface, while being electrically connected to the first surface electrode and the second surface electrode; a protective film which is arranged on the resistor so as to partially cover the first surface electrode and the second surface electrode; a first conductive resin layer which is arranged so as to extend over the first surface electrode and the protective film; and a second conductive resin layer which is arranged so as to extend over the second surface electrode and the protective film. The second lateral surface-side end of the first conductive resin layer and the first lateral surface-side end of the second conductive resin layer are at a distance from each other.
Inventors:
SHINOURA TAKANORI (JP)
Application Number:
PCT/JP2022/036708
Publication Date:
May 11, 2023
Filing Date:
September 30, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01C7/00; H01C1/084; H01C1/14; H01C17/23; H01C17/24
Domestic Patent References:
| WO2019116814A1 | 2019-06-20 | |||
| WO2019087725A1 | 2019-05-09 |
Foreign References:
| JP2015079872A | 2015-04-23 | |||
| JP2008053255A | 2008-03-06 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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