Title:
CHIP STACKING AND ENCAPSULATING METHOD, STACKED AND ENCAPSULATED CHIP AND ELECTRONIC STORAGE DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/142711
Kind Code:
A1
Abstract:
A chip stacking and encapsulating method, a stacked and encapsulated chip and an electronic storage device. The method comprises: stacking a plurality of layers of wafers to be processed; fixedly connecting the plurality of layers of said wafers, so as to obtain a stacked wafer group, wherein the stacked wafer group comprises a plurality of stacked chip groups, each stacked chip group comprises a plurality of unit chips, each unit chip comprises a cutting area and a micro-circuit area, the cutting area comprises a through hole, a pad of the unit chip is arranged on an inner side of the through hole, and through holes of different unit chips in the same stacked chip group form a cavity that penetrates the stacked chip group; dividing the stacked wafer group into pieces according to the cutting area, so as to obtain a plurality of separate stacked chip groups; and performing signal connection on the stacked chip groups and an encapsulation substrate by using the cavity, so as to obtain a stacked and encapsulated chip. By means of the present invention, a chip stacking and encapsulating process is simplified, thereby improving the stacking and encapsulation efficiency.
Inventors:
LIU HUAN (CN)
DAI QIANG (CN)
DAI QIANG (CN)
Application Number:
PCT/CN2021/128158
Publication Date:
July 07, 2022
Filing Date:
November 02, 2021
Export Citation:
Assignee:
ZHEJIANG HIKSTOR TECH CO LTD (CN)
International Classes:
H01L25/065; H01L23/48
Foreign References:
| US20110316123A1 | 2011-12-29 | |||
| US20110316123A1 | 2011-12-29 | |||
| US20130105949A1 | 2013-05-02 | |||
| US20120025355A1 | 2012-02-02 | |||
| US20060228825A1 | 2006-10-12 | |||
| KR20010053901A | 2001-07-02 |
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
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