Title:
CHIP STRUCTURE, MANUFACTURING METHOD FOR CHIP STRUCTURE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/103497
Kind Code:
A1
Abstract:
Embodiments of the present application provide a chip structure, a manufacturing method for a chip structure, and an electronic device. The chip structure comprises: a circuit board provided with a plurality of pads, wherein the plurality of pads comprise a plurality of first pads and at least one second pad; a chip electrically connected to the first pads, wherein the second pad is a redundant pad; a plurality of electrical connection structures comprising a plurality of first electrical connection structures and at least one second electrical connection structure, wherein the first electrical connection structures are located on the surfaces of the first pads and electrically connect the chip to the first pads, and the second electrical connection structure is located on the surface of the second pad; and a packaging layer filling a gap between the circuit board and the chip. The chip structure can improve the reliability of a solder joint between a chip and a circuit board.
Inventors:
HUO YUAN (CN)
Application Number:
PCT/CN2022/118045
Publication Date:
June 15, 2023
Filing Date:
September 09, 2022
Export Citation:
Assignee:
HONOR DEVICE CO LTD (CN)
International Classes:
H01L23/488; H01L21/60
Foreign References:
| CN115000036A | 2022-09-02 | |||
| JP2001015554A | 2001-01-19 | |||
| CN1992238A | 2007-07-04 | |||
| US20060231949A1 | 2006-10-19 | |||
| US20160049379A1 | 2016-02-18 | |||
| US6787918B1 | 2004-09-07 | |||
| CN202111490490A | 2021-12-08 |
Attorney, Agent or Firm:
SHENPAT INTELLECTUAL PROPERTY AGENCY (CN)
Download PDF: