Title:
CHIP-ON-SUBMOUNT
Document Type and Number:
WIPO Patent Application WO/2022/264972
Kind Code:
A1
Abstract:
This chip-on-submount comprises, for example: a submount; a coating layer provided on the submount and intersecting a first direction; a laser element having a light emitting unit positioned at an intermediate portion of a second direction intersecting the first direction and outputting laser light in a third direction intersecting the first direction and the second direction; and a bonding wire that applies, to the laser element, a pressing force including a force component toward the opposite direction of the first direction. Residual stress that presses toward the center in the second direction is generated in the coating layer. A first moment, generated by the residual stress, about the central axis of the light emitting unit running along the third direction, and a second moment, generated by the pressing force acting on the laser element from the bonding wire, about the central axis of the light emitting unit cancel each other out.
Inventors:
KAWAKITA YASUMASA (JP)
MIURA MASAKAZU (JP)
ISHII HIROTATSU (JP)
TAKEUCHI TETSUYA (JP)
MIURA MASAKAZU (JP)
ISHII HIROTATSU (JP)
TAKEUCHI TETSUYA (JP)
Application Number:
PCT/JP2022/023669
Publication Date:
December 22, 2022
Filing Date:
June 13, 2022
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01S5/02345; H01S5/023
Domestic Patent References:
| WO2017138666A1 | 2017-08-17 |
Foreign References:
| JP2004140052A | 2004-05-13 | |||
| JP2012054474A | 2012-03-15 | |||
| JP2014022481A | 2014-02-03 | |||
| JP2002261376A | 2002-09-13 | |||
| JP2017017297A | 2017-01-19 | |||
| US20190044302A1 | 2019-02-07 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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