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Patent Searching and Data


Title:
CHIP TEMPERATURE TEST METHOD AND APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/002031
Kind Code:
A1
Abstract:
A chip temperature test method and apparatus applied to automatic test equipment ATE, the ATE comprising a parameter measurement unit PMU and a digital signal processing DSP chip (60). The chip temperature test method comprises: if the time a target chip spends in a test environment satisfies a stabilization time, the PMU acquiring the electrical parameters of a diode of an electrostatic discharge ESD protection circuit of the target chip, and sending the electrical parameters to the DSP chip (60), wherein the target chip is in a non-powered state; the DSP chip (60) receiving the electrical parameters and, according to the electrical parameters, querying corresponding relationships to find the current temperature of the target chip; the corresponding relationships describing how the electrical parameters of the same category of chip as the target chip change with temperature, and the stabilization time describing the time required for the temperature of the same category of chip as the target chip to reach the same temperature as the test environment.

Inventors:
JIAO HUIFANG (CN)
ZHOU XUE (CN)
LIU SHANGYUAN (CN)
CHEN ZHOUPAN (CN)
ZHU GUOLIANG (CN)
ZHANG MIN (CN)
Application Number:
PCT/CN2023/102517
Publication Date:
January 04, 2024
Filing Date:
June 26, 2023
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G01R31/28; G01K13/00
Foreign References:
CN114264932A2022-04-01
CN110632494A2019-12-31
CN114324992A2022-04-12
CN111190452A2020-05-22
CN106019111A2016-10-12
CN112945418A2021-06-11
US20170030961A12017-02-02
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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