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Patent Searching and Data


Title:
CHIP TEST INDENTER AND CHIP TEST DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/206591
Kind Code:
A1
Abstract:
A chip test indenter (1) and a chip test device, wherein the chip test indenter (1) comprises an indenter body (11), an adapter plate (12), a socket (13) and an adsorption structure (14); wherein the adapter plate (12) is embedded into the indenter body (11), and the adapter plate (12) is provided with a first electrical connection point (121) and a second electrical connection point (122), wherein the first electrical connection point (121) is electrically connected to the second electrical connection point (122); the bottom of the socket (13) is embedded into the indenter body (11), one end of the adsorption structure (14) is arranged outside the indenter body (11), and the other end of the adsorption structure (14) passes through the bottom of the socket (13); when a chip (3) to be tested is adsorbed into the socket (13) by the adsorption structure (14), the first electrical connection point (121) and a PAD surface (31) of the chip (3) to be tested form an electrical connection, and the second electrical connection point (122) and a test circuit board (2) form an electrical connection, so as to test the chip (3) to be tested. The chip test indenter (1) can simultaneously complete the test on the PAD surface (31) and a non-PAD surface (32).

Inventors:
WANG PAN (CN)
DUAN YUANHONG (CN)
WANG HUAGAO (CN)
Application Number:
PCT/CN2019/081758
Publication Date:
October 15, 2020
Filing Date:
April 08, 2019
Export Citation:
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Assignee:
SHENZHEN GOODIX TECH CO LTD (CN)
International Classes:
G01R31/28
Foreign References:
CN207440133U2018-06-01
CN109001499A2018-12-14
CN109490750A2019-03-19
CN105934681A2016-09-07
CN107402345A2017-11-28
CN207050762U2018-02-27
US20160154023A12016-06-02
Attorney, Agent or Firm:
BEIJING HEADSTAY INTELLECTUAL PROPERTY AGENCY (CN)
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