Title:
CHIP THROUGH FLOORING MATERIAL USING PLA RESIN
Document Type and Number:
WIPO Patent Application WO/2011/115382
Kind Code:
A2
Abstract:
Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin comprises: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.
Inventors:
HUANG CHENG-ZHE (KR)
KIM JI-YOUNG (KR)
PARK KI-BONG (KR)
KANG CHANG-WON (KR)
KWON JUN-HYUK (KR)
KWON HYUN-JONG (KR)
PARK SANG-SUN (KR)
KIM JANG-KI (KR)
LEE GYEONG-MIN (KR)
KIM JI-YOUNG (KR)
PARK KI-BONG (KR)
KANG CHANG-WON (KR)
KWON JUN-HYUK (KR)
KWON HYUN-JONG (KR)
PARK SANG-SUN (KR)
KIM JANG-KI (KR)
LEE GYEONG-MIN (KR)
Application Number:
PCT/KR2011/001559
Publication Date:
September 22, 2011
Filing Date:
March 07, 2011
Export Citation:
Assignee:
LG HAUSYS LTD (KR)
HUANG CHENG-ZHE (KR)
KIM JI-YOUNG (KR)
PARK KI-BONG (KR)
KANG CHANG-WON (KR)
KWON JUN-HYUK (KR)
KWON HYUN-JONG (KR)
PARK SANG-SUN (KR)
KIM JANG-KI (KR)
LEE GYEONG-MIN (KR)
HUANG CHENG-ZHE (KR)
KIM JI-YOUNG (KR)
PARK KI-BONG (KR)
KANG CHANG-WON (KR)
KWON JUN-HYUK (KR)
KWON HYUN-JONG (KR)
PARK SANG-SUN (KR)
KIM JANG-KI (KR)
LEE GYEONG-MIN (KR)
International Classes:
B32B21/08; B32B21/02; B32B27/18
Foreign References:
| US20090270524A1 | 2009-10-29 | |||
| US20060142505A1 | 2006-06-29 | |||
| US4902367A | 1990-02-20 | |||
| US20090311510A1 | 2009-12-17 | |||
| US20020150775A1 | 2002-10-17 |
Other References:
None
See also references of EP 2548735A4
See also references of EP 2548735A4
Attorney, Agent or Firm:
DAE-A INTERNATIONAL IP & LAW FIRM et al. (KR)
특허법인 대아 (KR)
특허법인 대아 (KR)
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Claims: