Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CHIP TRANSFER DEVICE AND METHOD
Document Type and Number:
WIPO Patent Application WO/2024/031915
Kind Code:
A1
Abstract:
The present disclosure relates to a chip transfer device and method. The chip transfer device comprises a first substrate and a second substrate which are fixedly arranged; a magnetic device is provided on the first substrate; the magnetic device is located between the first substrate and the second substrate; the surface of the second substrate facing away from the magnetic device is used for adsorbing chips to be transferred each comprising a magnetic unit; the magnetic device comprises a wire and a plurality of magnetic cores; the wire is arranged around the magnetic cores; the magnetic cores and said chips are arranged in a one-to-one correspondence mode; the magnetic cores are used for providing magnetic force after the wire is energized; and said chips are fixedly arranged on the surface of the second substrate facing away from the magnetic device. According to the technical solution provided in embodiments of the present disclosure, the chips to be transferred can be prevented from flip or translation in the chip transfer process. The chip transfer device can be used for transferring LED chips in batches, thereby improving the transfer efficiency, and reducing costs; moreover, the chip transfer device is simple in structure and easy to implement.

Inventors:
CHEN JUNJI (CN)
Application Number:
PCT/CN2022/140757
Publication Date:
February 15, 2024
Filing Date:
December 21, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHANGHAI WINGTECH ELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
H01L21/683; H01L21/677; H01L21/68; H01L27/15
Domestic Patent References:
WO2021134490A12021-07-08
Foreign References:
CN115394703A2022-11-25
CN211480078U2020-09-11
CN109755162A2019-05-14
CN109801868A2019-05-24
CN114335063A2022-04-12
CN111244010A2020-06-05
Attorney, Agent or Firm:
BEIJING MIZAR STAR INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
Download PDF: