CHIP-TYPE CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2022/065004

A1

Provided is a method for manufacturing a chip-type ceramic electronic component that has an external electrode structure which can protect a ceramic element body from cracks due to stress caused by flexure of a substrate and the like, and can have a lower electric resistance than a resin electrode.　An external electrode 11 includes a glass-free sintered layer 12 that does not contain glass. A glass-free conductive paste, which contains a thermosetting resin, and conductive metal powder formed of an alloy of tin and at least one selected from among copper and nickel, but does not contain glass, is prepared, the glass-free conductive paste is applied to cover a portion of the surface of a ceramic element body 3, and then the ceramic element body 3 coated with the glass-free conductive paste is heat-treated at a temperature, which is 400 °C higher than the curing temperature of the thermosetting resin, for example at 600 °C. Most of the thermosetting resin is thermally decomposed or burned away by the heat treatment, and the conductive metal powder is sintered to form an integrated metal sintered body 13.

JPS5717124	CAPACITOR AND METHOD OF PRODUCING SAME
JP6278595	Lamination ceramic electronic parts and a manufacturing method for the same
JPH0670936	[Title of Invention] Multilayer Ceramic Capacitor

ZENZAI KOTA (JP)

PCT/JP2021/032563

March 31, 2022

September 04, 2021

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MURATA MANUFACTURING CO (JP)

H01G4/232; H01G4/30

WO2007072894A1

2007-06-28

JP2002367849A	2002-12-20
JP2016072485A	2016-05-09
JP2017034010A	2017-02-09
JP2018063998A	2018-04-19
JP2013118358A	2013-06-13
JP2001118424A	2001-04-27
JP2009099443A	2009-05-07

KOSHIBA, Masaaki (JP)

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