Title:
CHIP-TYPE ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/101405
Kind Code:
A1
Abstract:
Provided is a chip-type electronic component for which it is easy to place spacers having sufficient heat resistance in a desired position and orientation. On a mounting surface (6), spacers (16, 17) have a prescribed thickness direction dimension (T) measured in a direction perpendicular to the mounting surface (6), and, for example, there is a "squeal" suppression effect for a laminated ceramic capacitor, and it is also possible to have three-dimensional mounting. The spacers (16, 17) have as a main component an intermetallic compound that contains a high-melting-point metal of at least one type selected from Cu and Ni, and Sn as a low-melting-point metal.
Inventors:
FUJITA YUKIHIRO (JP)
KANBE SHOGO (JP)
NAKANO KOSUKE (JP)
OTSUKA HIDEKI (JP)
KANBE SHOGO (JP)
NAKANO KOSUKE (JP)
OTSUKA HIDEKI (JP)
Application Number:
PCT/JP2017/043063
Publication Date:
June 07, 2018
Filing Date:
November 30, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/252; H01G2/06; H01G4/12; H01G4/228; H01G4/232; H01G4/30
Domestic Patent References:
| WO2016098702A1 | 2016-06-23 | |||
| WO2010122764A1 | 2010-10-28 |
Foreign References:
| JP2013128090A | 2013-06-27 | |||
| JP2013065728A | 2013-04-11 | |||
| JPH08330174A | 1996-12-13 |
Attorney, Agent or Firm:
KOSHIBA, Masaaki (JP)
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