Title:
CHIP-TYPE ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/100538
Kind Code:
A1
Abstract:
Provided is a chip-type electronic component configured such that a large change in the electric characteristics can be suppressed after the chip-type electronic component is reflow-mounted. This chip-type electronic component comprises: a ceramic element body comprising a semiconductor ceramic material comprising an oxide containing Ti and Ba; and a solid metal electrode that is formed on an end of the ceramic element body, and that makes ohmic contact with the ceramic element body. The chip-type electronic component satisfies the following formula (1), and the film stress of the solid metal electrode is 140 MPa or more. Formula (1) A / V ≧ 3.3 (mm2 / mm3)
Here, A (mm2) is the surface area of the solid metal electrode, and V (mm3) is the volume of the ceramic element body.
Inventors:
NAGATOMO MASAKIYO (JP)
ISOGAI KEISUKE (JP)
SAKI YOSHINOBU (JP)
ISOGAI KEISUKE (JP)
SAKI YOSHINOBU (JP)
Application Number:
PCT/JP2022/039723
Publication Date:
June 08, 2023
Filing Date:
October 25, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01C7/00; H01C1/14; H01C7/02; H01G4/12; H01G4/30
Domestic Patent References:
| WO2014017365A1 | 2014-01-30 | |||
| WO2016042884A1 | 2016-03-24 |
Foreign References:
| JP2018157183A | 2018-10-04 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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