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Title:
CHLOROPRENE POLYMER AND DIP-MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/190144
Kind Code:
A1
Abstract:
Provided is a chloroprene polymer which has high tensile strength at break and a low modulus at 100% elongation, and which makes it possible to obtain a dip-molded product having excellent texture. The present invention provides a chloroprene polymer, wherein the loss tangent tanδ in the 10 Hz frequency region of a film containing the chloroprene polymer, as obtained when the tensile-type dynamic viscoelasticity is measured in accordance with the non-resonant forced vibration technique at a temperature of 25°C and under a strain of 0.75%, is 0.08 to 0.14, and the film is obtained by drying chloroprene polymer latex containing the chloroprene polymer for three days at 23°C or lower.

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Inventors:
KUMAGAI YUSHI (JP)
ITO MISAKI (JP)
Application Number:
PCT/JP2023/011785
Publication Date:
October 05, 2023
Filing Date:
March 24, 2023
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08L11/02; C08F36/18; C08F236/18
Domestic Patent References:
WO2014017216A12014-01-30
WO2012070347A12012-05-31
WO2022202254A12022-09-29
WO2022202556A12022-09-29
Foreign References:
JP2019143002A2019-08-29
JPH07292165A1995-11-07
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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