Title:
CIRCUIT ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2022/260023
Kind Code:
A1
Abstract:
Disclosed is a circuit assembly that has better heat radiation efficiency than the conventional structure while ensuring a waterproofness. This circuit assembly 10 comprises: a case 16 having an opening hole 14 on the bottom; a heat-generating component 12 that is housed inside the case 16, and that is exposed to the outside from the opening hole 14 and is in thermal contact with a heat radiation subject 18; and a ring-shaped sealing member 22 that is arranged at a peripheral edge 72 of the opening hole 14 and is sandwiched between the case 16 and an attachment member 20 attached to the case 16.
Inventors:
HORIBA ISSEI (JP)
FUJIMURA YUKI (JP)
TAKEDA HITOSHI (JP)
FUJIMURA YUKI (JP)
TAKEDA HITOSHI (JP)
Application Number:
PCT/JP2022/022876
Publication Date:
December 15, 2022
Filing Date:
June 07, 2022
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H05K7/20; B60R16/02; H02G3/14; H02G3/16; H05K5/02; H05K7/06
Foreign References:
| JP2005294741A | 2005-10-20 | |||
| JP2021015959A | 2021-02-12 | |||
| JP2018164359A | 2018-10-18 | |||
| JP2017112718A | 2017-06-22 | |||
| JP2004247561A | 2004-09-02 | |||
| JP2008166383A | 2008-07-17 |
Attorney, Agent or Firm:
KASAI & NAKANE INTERNATIONAL PATENT FIRM et al. (JP)
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