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Title:
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME
Document Type and Number:
WIPO Patent Application WO/2020/080879
Kind Code:
A1
Abstract:
Disclosed is an antenna module including a circuit board, a communication circuit disposed on one surface of the circuit board, one or more antenna elements electrically connected to the communication circuit and arranged in at least a part of the circuit board, and a connection circuit board which includes an at least partially covered opening and is disposed on the one surface of the circuit board such that the communication circuit is disposed in an inner space of the connection circuit board.

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Inventors:
LEE JONGWON (KR)
SON DONGIL (KR)
Application Number:
PCT/KR2019/013743
Publication Date:
April 23, 2020
Filing Date:
October 18, 2019
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/14; H01Q1/38; H01R12/71; H05K1/02; H05K1/11; H05K9/00
Domestic Patent References:
WO2018119153A22018-06-28
Foreign References:
US20150016078A12015-01-15
KR101772490B12017-08-30
US20100240327A12010-09-23
KR20180090536A2018-08-13
US20160181714A12016-06-23
US20120137505A12012-06-07
US20150261266A12015-09-17
Other References:
See also references of EP 3850922A4
Attorney, Agent or Firm:
YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)
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