CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE

WIPO Patent Application WO/2024/011893

A1

The present application relates to the technical field of electronic products. Provided are a circuit board, a circuit board assembly, and an electronic device, which solve the problem of a waste of space in a circuit board. Specifically, the circuit board comprises a circuit board body, a first group of bonding pads, and a second group of bonding pads, wherein the circuit board body comprises a first surface; the first group of bonding pads and the second group of bonding pads are arranged on the first surface; the first group of bonding pads are distributed in a first circle, are configured to be welded to a first shielding cover, and include first bonding pads arranged on the side of the first circle close to the second group of bonding pads; the second group of bonding pads are distributed in a second circle, are configured to be welded to a second shielding cover, and include second bonding pads arranged on the side of the second circle close to the first group of bonding pads; and the first bonding pads and the second bonding pads form an integral structural member. In this way, the distance that is originally present between adjacent bonding pads in the prior art is eliminated, which is conducive to the development of the miniaturization and ultra-thinness of the circuit board body.

SHI PENGFEI (CN)
YE PENG (CN)
CAO CHENGZHUANG (CN)
LIU YUHAN (CN)

PCT/CN2023/074153

January 18, 2024

February 01, 2023

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HONOR DEVICE CO LTD (CN)

H05K1/02; H05K1/11; H05K9/00

CN210808100U	2020-06-19
CN205491639U	2016-08-17
CN205847712U	2016-12-28
US20200305314A1	2020-09-24
CN205812494U	2016-12-14

BEIJING ZBSD PATENT & TRADEMARK AGENT LTD. (CN)

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