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Title:
CIRCUIT BOARD ASSEMBLY WELDING DEVICE AND CIRCUIT BOARD ASSEMBLY WELDING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/061139
Kind Code:
A1
Abstract:
A circuit board assembly (21) welding device (1) and a circuit board assembly (21) welding method. In the welding device (1), at least two bearing seats (13) are provided on a base (11); the bearing seats (13) are located in the space between the base (11) and a pressing plate assembly (12); the bearing seats (13) each comprises a workbench (131); the workbench (131) is located on the side of the bearing seat (13) facing the pressing plate assembly (12); circuit board assemblies (21) are placed on the workbenches (131), and the pressing plate assembly (12) presses the circuit board assemblies (21) on the workbenches (131) to provide pressure for the circuit board assemblies (21), so as to achieve solder connection of the circuit board assemblies (21). The at least two bearing seats (13) comprise at least one adjustable bearing seat (13a), and the distance between the workbench (131) of the adjustable bearing seat (13a) and the base (11) is adjustable.

Inventors:
GUO JIANQIANG (CN)
LUO WENJUN (CN)
LI MINGCHUAN (CN)
Application Number:
PCT/CN2022/118796
Publication Date:
April 20, 2023
Filing Date:
September 14, 2022
Export Citation:
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Assignee:
HONOR DEVICE CO LTD (CN)
International Classes:
B23K3/00; B23K3/08
Foreign References:
CN113618192A2021-11-09
CN107949178A2018-04-20
CN212704895U2021-03-16
CN211305139U2020-08-21
JPH04137795A1992-05-12
CN109121323A2019-01-01
CN107710887A2018-02-16
CN205200751U2016-05-04
CN213080344U2021-04-30
CN202111189553A2021-10-13
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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