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Patent Searching and Data


Title:
CIRCUIT BOARD ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2020/090803
Kind Code:
A1
Abstract:
A circuit board assembly (8) is provided with: a wiring board (81); a coin-type secondary battery (1) that is a lithium secondary battery electrically connected to the wiring board (81) by means of solder reflowing; and a wireless communication device (82) that is electrically connected to the wiring board (81). The coin-type secondary battery (1) is provided with a positive electrode that includes a sintered compact, a negative electrode that includes a sintered compact, an electrolyte layer that is provided between the positive electrode and the negative electrode, and an exterior body that has a sealed space for housing the positive electrode, the negative electrode, and the electrolyte layer. When the capacity of the positive electrode is denoted by C and the capacity of the negative electrode is denoted by A, 1.03

Inventors:
YURA YUKINOBU (JP)
MAEDA KAZUKI (JP)
MIZUKAMI SHUNSUKE (JP)
Application Number:
PCT/JP2019/042329
Publication Date:
May 07, 2020
Filing Date:
October 29, 2019
Export Citation:
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Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01M4/13; H01M2/10; H01M4/131; H01M10/052; H01M10/0585; H01M4/485; H01M4/525
Domestic Patent References:
WO2018147387A12018-08-16
WO2017188238A12017-11-02
WO2018092484A12018-05-24
WO2017146088A12017-08-31
Foreign References:
JP2018504737A2018-02-15
JP4392189B22009-12-24
JP5587052B22014-09-10
JP2015185337A2015-10-22
Attorney, Agent or Firm:
MATSUSAKA, Masahiro et al. (JP)
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